Zobrazeno 1 - 10
of 14
pro vyhledávání: '"Thomas Krivec"'
Autor:
Claus O.W. Trost, Martin Krobath, Stanislav Žák, René Hammer, Thomas Krivec, Hans-Peter Gänser, Thomas W. Trost, Anton Hohenwarter, Megan J. Cordill
Publikováno v:
Materials & Design, Vol 227, Iss , Pp 111711- (2023)
Metallic foils are crucial to many applications ranging from printed circuit boards, aviation, aerospace, packaging, photovoltaics to batteries. In these applications they are often part of multifunctional composites, for which mechanical integrity i
Externí odkaz:
https://doaj.org/article/23d01a784cf74946848964ef04e3711b
Autor:
Werner Eßl, Georg Reiss, Peter Raninger, Werner Ecker, Nadine Körbler, Eva Gerold, Helmut Antrekowitsch, Jolanta Klocek, Thomas Krivec
Publikováno v:
Fluids, Vol 8, Iss 6, p 180 (2023)
Multi-droplet impingement is a fundamental aspect inherent to all kinds of technical spray processes which typically aim at enhancing the convective exchange of reagents or heat at the impinged surface. In this paper, the impingement of multiple drop
Externí odkaz:
https://doaj.org/article/b4c74c60113646ae8ca7e6ba40181b48
Autor:
Claus O.W. Trost, Stanislav Žák, Katharina Ruderes, René Hammer, Jördis Rosc, Thomas Krivec, Norbert Schell, Hans-Peter Gänser, Anton Hohenwarter, Megan J. Cordill
Publikováno v:
Composites / B 259, 110715 (2023). doi:10.1016/j.compositesb.2023.110715
Composites / B 259, 110715 (2023). doi:10.1016/j.compositesb.2023.110715
In many applications metal foils are part of multifunctional composites exhibiting a wide range of (thermo-)mechanical fatigue loading. Data about low cycle fatigue of meta
In many applications metal foils are part of multifunctional composites exhibiting a wide range of (thermo-)mechanical fatigue loading. Data about low cycle fatigue of meta
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9816b28aedcd08b443f75b271fb6afa9
https://bib-pubdb1.desy.de/record/582397
https://bib-pubdb1.desy.de/record/582397
Autor:
Angelika Hable, Paul Tabatabai, Hannah L. Lichtenegger, Anton Scherr, Thomas Krivec, Dieter P. Gruber
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 19
Increasingly high demands are being placed on the quality inspection of printed circuit boards (PCBs). A full surface inspection of all produced PCBs and a high defect detection accuracy of the inspection system are becoming prerequisites for an effi
Autor:
Chongnan Peng, Matthias Morak, Andreas Thalhamer, Mario Gschwandl, Peter Fuchs, Qi Tao, Thomas Krivec, Thomas Antretter, Miguel Angel Celigueta
Publikováno v:
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Autor:
Claus O.W. Trost, Martin Krobath, Stanislav Žák, René Hammer, Thomas Krivec, Hans-Peter Gänser, Thomas W. Trost, Anton Hohenwarter, Megan J. Cordill
Publikováno v:
SSRN Electronic Journal.
Autor:
Dionysios Manessis, Tobias Kupka, Gerhard Podhradsky, Rainer Pamminger, Jakub Pawlikowski, Nils F. Nissen, Martin Schneider-Ramelow, Karsten Schischke, Thomas Krivec, Klaus-Dieter Lang, Sebastian Glaser
Publikováno v:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
Embedding technologies for heterogeneous integration of active and passive components are a promising approach for functional modules on the printed circuit board level. Modularity and embedding related miniaturization are key enablers for some upcom
Autor:
Hable, Angelika1 angelika.hable@pccl.at, Tabatabai, Paul1, Lichtenegger, Hannah L.1, Scherr, Anton2, Krivec, Thomas3, Gruber, Dieter P.1
Publikováno v:
Journal of Microelectronic & Electronic Packaging. 2022, Vol. 19 Issue 4, p123-130. 8p.
Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards
Autor:
Katerina Macurova, Paul Angerer, Thomas Antretter, raul bermejo, Wilson Maia, Ronald Schöngrundner, Thomas Krivec, Mike Morianz, Michel Brizoux
Publikováno v:
Montanuniversität Leoben
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::1a823fce288ad079791fd991c780df29
https://pure.unileoben.ac.at/portal/en/publications/simulation-of-stress-distribution-in-assembled-silicon-dies-and-deflection-of-printed-circuit-boards(8b1c08ba-b16d-486c-932a-f403b60810a1).html
https://pure.unileoben.ac.at/portal/en/publications/simulation-of-stress-distribution-in-assembled-silicon-dies-and-deflection-of-printed-circuit-boards(8b1c08ba-b16d-486c-932a-f403b60810a1).html
Autor:
Eßl, Werner, Reiss, Georg, Raninger, Peter, Ecker, Werner, Körbler, Nadine, Gerold, Eva, Antrekowitsch, Helmut, Klocek, Jolanta, Krivec, Thomas
Publikováno v:
Fluids; Jun2023, Vol. 8 Issue 6, p180, 15p