Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Thomas Huelsmann"'
Autor:
Thomas Huelsmann
Publikováno v:
Journal of Learning for Development, Vol 1, Iss 1 (2013)
Externí odkaz:
https://doaj.org/article/884e21d1d5b4485ab05a753db7fa5fb0
Autor:
Thomas Thomas, Andry Liong, Thomas Huelsmann, Tatjana Koenigsmann, Patrick Brooks, W. Cho, Fabian Michalik, Neal Wood, Carrick Chan
Publikováno v:
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
This work demonstrates the development of surface treatment systems of copper which can meet all of the challenges of mobile electronic devices manufacturing for high frequency function. These challenges are low signal loss and enhanced functional pe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3cd6cad21bdda7adf36c055991b03b20
https://doi.org/10.1109/impact50485.2020.9268557
https://doi.org/10.1109/impact50485.2020.9268557
Autor:
Neal Wood, C. Chan, P. Haarmann, Thomas Thomas, W. Cho, Thomas Huelsmann, Andry Liong, Kwonil Kim, Patrick Brooks, T. Koenigsmann
Publikováno v:
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Blind micro-via ablation can be made using a variety of different laser drill types. One of the most commonly used is the Carbon Dioxide (CO 2 ) Laser type, which has advantages in the industrial manufacture process due to relatively fast drill speed
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5341856019faeaebb2286c70b3f5aa91
https://doi.org/10.1109/impact50485.2020.9268573
https://doi.org/10.1109/impact50485.2020.9268573
Autor:
Thomas Huelsmann, Josef Gaida, Thomas Thomas, Patrick Brooks, Yuan Zou, Barbara Geibel, Ken Kim, Belen Gil-Ibanez, Felix Tang, Fabian Michalik
Publikováno v:
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Follow the development of electronic manufacturing for future microelectronics application where cleanliness of the process is becoming substantial concern, a new oxide replacement process is developed. This work demonstrates a newly developed oxide
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d5169826c07cce041181bf94f403aaa7
https://doi.org/10.1109/impact50485.2020.9268580
https://doi.org/10.1109/impact50485.2020.9268580
Autor:
Thomas Huelsmann, Stephan Hotz, Y. Zou, Arno Clicque, S. Li, Gil-Ibanez, W. Cho, Martin Thoms, Patrick Brooks
Publikováno v:
2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
One key application for the manufacturing of MLB and HDI printed circuit boards are pretreatment systems aimed at providing the optimum adhesion of organic coatings such as Photoimagable Resists (such as Dry Films [DF] and Liquid Photo Imageable Resi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d31fdf48e3293f8962f5c4b9625d51ea
https://doi.org/10.1109/impact.2016.7799995
https://doi.org/10.1109/impact.2016.7799995
Autor:
M. Kloppisch, R. Haidar, N. Luetzow, Fabian Michalik, Thomas Huelsmann, Gabriela Schmidt, Patrick Brooks
Publikováno v:
2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
With the trend towards miniaturization IC-manufacturers are permanently requested to increase the density of interconnects generating conductors featuring finer lines and spaces. Advanced manufacturing technologies such as Semi-Additive-Processing (S
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e7f62b131e74d2654dd62c4b457fc6f9
https://doi.org/10.1109/impact.2015.7365190
https://doi.org/10.1109/impact.2015.7365190
Autor:
Thomas Huelsmann
Publikováno v:
Journal of Learning for Development, Vol 1, Iss 1 (2013)
Book Review: Developing Countries in the e-Learning Era
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doajarticles::0e493c615fdf9d5f4f24b475d33b016f
https://jl4d.org/index.php/ejl4d/article/view/34
https://jl4d.org/index.php/ejl4d/article/view/34