Zobrazeno 1 - 10
of 59
pro vyhledávání: '"Thomas Gottwald"'
Autor:
Marc Schurr, Thomas Gottwald
Publikováno v:
Endoscopy International Open, Vol 06, Iss 10, Pp E1264-E1265 (2018)
Externí odkaz:
https://doaj.org/article/8553e1bbd0ba4055804e654bdaeefd9e
Autor:
Ida Camperchioli, Antonio Caputo, A. Scozzarro, Fabrizio Altorio, Marc O. Schurr, Thomas Gottwald, Cristina Grossi, Nicola Di Lorenzo
Publikováno v:
Minimally Invasive Therapy & Allied Technologies. 30:187-194
Roux-en-Y gastric by-pass (RYGB) is one of the most effective bariatric procedures, but the rate of weight regain (WR) can reach 63% after the second year. Enlargement of the gastrojejunal anastomosis is one of the reported causes. A newly CE-marked
Publikováno v:
IEEE Transactions on Antennas and Propagation. 67:6051-6058
Radar systems have become more important in the automotive field, especially for autonomous driving. A crucial part of the hardware is the antenna which is connected by lines to the radar chip. These components are usually built on printed circuit bo
Autor:
Mouen A. Khashab, Arthur Schmidt, Juergen Hochberger, Peter Bauerfeind, Timo Weiland, Franziska Baur, Sabrina Rohrer, Karel Caca, Marc O. Schurr, Thomas Gottwald, Edris Wedi
Publikováno v:
Minimally Invasive Therapy & Allied Technologies. 29:121-139
Since its market launch in 2007, the endoscopic OTSC clipping system has been the object of intensive clinical research. These data were systematically collected for post-market clinical follow-up (PMCF). The aim of the study was the systematic revie
Publikováno v:
Jusletter-IT.
Efficacy and safety of the remOVE System for OTSC® and FTRD® clip removal: data from a PMCF analysis
Autor:
Thomas Gottwald, Marc O. Schurr, Arthur Schmidt, Peter Bauerfeind, Antonio Caputo, Sebastian Schostek, Chi-Nghia Ho, Karel Caca
Publikováno v:
Minimally Invasive Therapy & Allied Technologies. 27:138-142
Introduction: The remOVE System (Ovesco Endoscopy AG, Tuebingen, Germany) is a medical device for the endoscopic removal of OTSC or FTRD clips (Ovesco Endoscopy AG, Tuebingen, Germany). The aim of this paper is to assess the efficacy and safety of th
Autor:
Thomas Gottwald, Tetsuya Onishi, Alex Bruderer, Letz Martin, Siddharth Ravichandran, Brandon T. Gore, William J. Kozlovsky, Romeo Premerlani, Holger Maune, Mathias Mydlak, Shigeo Onitake, Manuel Martina, Jost Matthias
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
A number of glass substrates made from the SCHOTT glass AF32_eco in a thickness of 0.1mm are metallized with different processes. On the metallized glass substrates, microstrip lines as well as ring resonator structures are realized which are optimiz
Publikováno v:
ISMICT
In today’s regulatory environment, special attention must be dedicated to the assessment of both performance and applicability of a novel technology before being introduced in the medical device market. An innovative medical device must undergo a s
Autor:
Thomas Gottwald, Christian Roessle
Publikováno v:
Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies
The electrification of the power train of hybrid electric vehicles (HEV) and electric vehicles (EV) increases the power demand and the power dissipation of power electronic modules. The p 2 Pack technology is an embedding technology for power devices
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2505c02ee2efff11285829a7e8a83829
https://doi.org/10.1002/9781119313991.ch10
https://doi.org/10.1002/9781119313991.ch10
Publikováno v:
Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies
Currently, there are two major trends in embedding technology: embedding for system in package and system in board (SiB). This chapter discusses the basic construction, manufacturing process, design features, manufacturing format, package performance
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ecb79f79a883475812af3d1c0d7edc60
https://doi.org/10.1002/9781119313991.ch9
https://doi.org/10.1002/9781119313991.ch9