Zobrazeno 1 - 10
of 29
pro vyhledávání: '"Thomas E. Sarvey"'
Monolithic Microfluidic Cooling of a Heterogeneous 2.5-D FPGA With Low-Profile 3-D Printed Manifolds
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:974-982
Heterogeneous integration techniques such as 2.5-D system-in-packages (SiPs) present new challenges that include higher aggregate package power as well as increased thermal crosstalk between different chiplets due to their proximity. This creates the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5c1a7f40870e49d82b59d32d581fc712
https://doi.org/10.1109/tcpmt.2021.3082013
https://doi.org/10.1109/tcpmt.2021.3082013
Autor:
Aravind Dasu, Thomas E. Sarvey, Sreejith Kochupurackal Rajan, Gutala Ravi Prakash, Ankit Kaul, Muhannad S. Bakir
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 9:2393-2403
The 2.5-D integration is becoming a common method of tightly integrating heterogeneous dice with dense interconnects for efficient, high-bandwidth inter-die communication. While this tight integration improves performance, it also increases the chall
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::19aa2ea5bfc9c68ec24f068cbf59c1b3
https://doi.org/10.1109/tcpmt.2019.2930481
https://doi.org/10.1109/tcpmt.2019.2930481
Autor:
Huan Yu, Hanju Oh, Thomas E. Sarvey, Muhannad S. Bakir, Er-Ping Li, Hang Jin, Madhavan Swaminathan, Yong-Sheng Li
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 9:1244-1252
It is agreed that air-cooled heat sink (ACHS) would become incapable of 3-D integrated circuits (ICs). A switch from ACHS to a microfluidic heat sink (MFHS) is believed to be a promising solution. Tier-specific MFHS, where the flow rate of each tier
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e0d5eb0e308863c7229210d0ef1b8a40
https://doi.org/10.1109/tcpmt.2019.2920974
https://doi.org/10.1109/tcpmt.2019.2920974
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
In this paper, we evaluate the use of silicon microfluidic cooling in conjunction with 3D printing techniques to create an ultra-low profile cooling system tailored for 2.5D packages. We present the thermal challenges in 2.5D devices including higher
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::69900e5c2552a4f8aabd3170b86b7893
https://doi.org/10.1109/ectc32696.2021.00227
https://doi.org/10.1109/ectc32696.2021.00227
Publikováno v:
Journal of Heat Transfer. 143
Single-phase liquid cooling in microchannels and microgaps has been successfully demonstrated for heat fluxes of ∼1 kW/cm2 for silicon chips with maximum temperature below 100 °C. However, effectively managing localized hotspots in heterogeneous i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::05fe13cc2cf85036f2278d84a1da0d26
https://doi.org/10.1115/1.4049189
https://doi.org/10.1115/1.4049189
Autor:
Abdur Rahman, Yang Zhang, Muhannad S. Bakir, Thomas E. Sarvey, Colman Cheung, Aravind Dasu, Gutala Ravi Prakash
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 7:1617-1624
Microfluidic cooling has been demonstrated as an effective means of cooling microelectronic circuits with a very low convective thermal resistance and potential for integration in close proximity to the area of heat generation. However, microfluidic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1bde60e3ec313f37e48c83af74eda159
https://doi.org/10.1109/tcpmt.2017.2740721
https://doi.org/10.1109/tcpmt.2017.2740721
Autor:
Yogendra Joshi, Peter A. Kottke, Suresh K. Sitaraman, David C. Woodrum, Yuanchen Hu, Andrei G. Fedorov, Craig E. Green, Muhannad S. Bakir, Thomas E. Sarvey
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 7:1465-1475
As microelectronic system density continues to increase, cooling with conventional technologies continues to become more challenging and is often a limiter of performance and efficiency. The challenge arises due to both large heat fluxes generated ac
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a987f9a33ec0da3c4a22e878a3a781d7
https://doi.org/10.1109/tcpmt.2017.2704525
https://doi.org/10.1109/tcpmt.2017.2704525
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 7:1101-1110
In this paper, 2.5-D integrated circuits (ICs) using bridge-chip technology are thermally evaluated to investigate thermal challenges and opportunities for such multi-die packages. To this end, the objectives of this paper are twofold. First, thermal
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c25a6f0a88f3f901923ff30a9b31d813
https://doi.org/10.1109/tcpmt.2017.2710042
https://doi.org/10.1109/tcpmt.2017.2710042
Autor:
Peter A. Kottke, Xuchen Zhang, Thomas E. Sarvey, Muhannad S. Bakir, Andrei G. Fedorov, Mohamed H. Nasr, Craig E. Green, Yogendra Joshi
Publikováno v:
International Journal of Heat and Mass Transfer. 108:1702-1713
Understanding two-phase convective heat transfer under extreme conditions of high heat and mass fluxes and confined geometry is of fundamental interest and practical significance. In particular, next generation electronics are becoming thermally limi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d100a3a9a30ed421c652a2a307095d0e
https://doi.org/10.1016/j.ijheatmasstransfer.2016.12.056
https://doi.org/10.1016/j.ijheatmasstransfer.2016.12.056
Autor:
Muhannad S. Bakir, Yogendra Joshi, Yuanchen Hu, Xuchen Zhang, Thomas E. Sarvey, Craig E. Green, Andrei G. Fedorov, Daniel Lorenzini
Publikováno v:
International Journal of Heat and Mass Transfer. 103:1359-1370
The presence of variable heat fluxes, such as localized hotspots in integrated circuit (IC) architectures poses a key challenge for thermal management of existing (2D) and emerging three-dimensionally (3D) stacked chips. The use of conventional micro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::48ee26320f48b2b6b7864b4daf0e0938
https://doi.org/10.1016/j.ijheatmasstransfer.2016.08.040
https://doi.org/10.1016/j.ijheatmasstransfer.2016.08.040