Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Thomas Deuble"'
Autor:
Joachim N. Burghartz, Golzar Alavi, Bjorn Albrecht, Thomas Deuble, Mourad Elsobky, Saleh Ferwana, Christine Harendt, Yigit Mahsereci, Harald Richter, Zili Yu
Publikováno v:
IEEE Journal of the Electron Devices Society, Vol 7, Pp 776-783 (2019)
This paper reports on the status of a comprehensive ten-year research and development effort toward hybrid system-in-foil (HySiF). In HySiF, the merits of high-performance integrated circuits on ultra-thin chips and of large-area and discrete electro
Externí odkaz:
https://doaj.org/article/bb64a3b25bfb4cc39bd5683382dd2bc9
Autor:
Mourad Elsobky, Golzar Alavi, Björn Albrecht, Thomas Deuble, Christine Harendt, Harald Richter, Zili Yu, Joachim N. Burghartz
Publikováno v:
Proceedings, Vol 2, Iss 13, p 748 (2018)
Hybrid System-in-Foil exploits the complementary benefits of integrating embedded silicon chips with on-foil passive and active electronic components. In this work, the design, fabrication and characterization of three on-foil components, namely a hu
Externí odkaz:
https://doaj.org/article/3931a53734d343038176875db66f0c34
Autor:
Mohammed Alomari, Alessandro Ottaviani, Joachim N. Burghartz, Thomas Deuble, Christine Harendt, Bjorn Albrecht, Saleh Ferwana, Mourad Elsobky
Publikováno v:
IEEE Sensors Journal. 20:7595-7604
The characterization of multiple mechanically flexible passive and active electronic components, namely on-foil temperature sensor, relative humidity sensor, and ultra-thin microcontroller unit (MCU) integrated circuit (IC) is presented. These compon
Autor:
Saleh Ferwana, Harald Richter, Zili Yu, Christine Harendt, Bjorn Albrecht, Golzar Alavi, Yigit Mahsereci, Joachim N. Burghartz, Thomas Deuble, Mourad Elsobky
Publikováno v:
IEEE Journal of the Electron Devices Society. 7:776-783
This paper reports on the status of a comprehensive ten-year research and development effort toward hybrid system-in-foil (HySiF). In HySiF, the merits of high-performance integrated circuits on ultra-thin chips and of large-area and discrete electro
Autor:
Zili Yu, Joachim N. Burghartz, Mourad Elsobky, Alessandro Ottaviani, Mohammed Alomari, Thomas Deuble
Publikováno v:
2019 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS).
Hybrid System-in-Foil (HySiF) complements the merits of the very-large scale integration of silicon ICs with the largerarea electronics [1] , [2] . Both worlds/concepts are integrated on mechanically flexible substrates using, in our case, ChipFilm P
Autor:
Thomas Deuble, Bjorn Albrecht, Zili Yu, Christine Harendt, Mourad Elsobky, Harald Richter, Joachim N. Burghartz, Golzar Alavi
Publikováno v:
Proceedings, Vol 2, Iss 13, p 748 (2018)
Hybrid System-in-Foil exploits the complementary benefits of integrating embedded silicon chips with on-foil passive and active electronic components. In this work, the design, fabrication and characterization of three on-foil components, namely a hu
Publikováno v:
IET Irish Signals and Systems Conference (ISSC 2010).
IO-Link is a new point-to-point communication and connectivity protocol between a master and a sensor/actuator (device), using which it is possible to transfer serial data by way of switching output, using only 3 wires. Till date this protocol has be