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Publikováno v:
Journal of Electronic Packaging. 145
Two-phase immersion cooling (2PIC) has been proposed as a means of economically increasing overall energy efficiency while accommodating increased chip powers and system-level power density. Designers unfamiliar with Two-phase immersion technology ma
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9ec8ff9baaac78b63dad2a3d3e35fb36
https://doi.org/10.1115/1.4062403
https://doi.org/10.1115/1.4062403
