Zobrazeno 1 - 10
of 55
pro vyhledávání: '"Thierry Mourier"'
Autor:
Jean B. Hue, Vincent Moulin, Kim Abdoul-Carime, Vincent Berg, Baptiste Delplanque, Bertrand Dupont, David Fowler, Sylvain Guerber, Jérôme Meilhan, Sébastien Martin, Laurent Mendizabal, Thierry Mourier, Lea Oxaran, Florence Rigal, Fredertic Sermet, Sylvain Stanchina, Vencelass Rat, Leopold Virot, Francois Simoens
Publikováno v:
Photonic Instrumentation Engineering X.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ab299992d4ec3eb69a31d1a1cdf6fadc
https://doi.org/10.1117/12.2647535
https://doi.org/10.1117/12.2647535
Autor:
Lucile Arnaud, Chantal Karam, F. Servant, Severine Cheramy, S. Borel, Frank Fournel, Thierry Mourier, C. Dubarry, N. Bresson, Mathilde Gottardi, G. Mauguen, M. Assous
Publikováno v:
MRS Communications. 10:549-557
Recent applications require vertical chip stacking to increase the performance of many devices without the need of advanced node components. Image sensors and vision systems will embed more and more smart functions, for instance, image processing, ob
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8d7b7480a5dfd42a4eafae34dfbb2eed
https://doi.org/10.1557/mrc.2020.77
https://doi.org/10.1557/mrc.2020.77
Epoxy Wetting Flow and Adhesion Mechanism within a Small Gap and Small Pitch Copper Pillar Structure
Autor:
Mary-Ann Gasser, Abdenacer Ait Mani, Thierry Mourier, Alain Gueugnot, Patrick Peray, Loic Vanel, Catherine Barentin
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e3da824256fc67319fdb32a0aa122574
https://doi.org/10.1109/ectc51906.2022.00021
https://doi.org/10.1109/ectc51906.2022.00021
Autor:
Jean B. Hue, Vincent Moulin, Kim Abdoul-Carime, Nacer Aitmani, Laura Boutafa, Olivier Castany, Baptiste Delplanque, Jonathan Faugier-Tovar, Daivid Fowler, Sylvain Guerber, Gilles Lasfargues, Jérôme Meilhan, Laurent Mendizabal, Thierry Mourier, Nadia Miloud-Ali, Frédéric Sermet, Sylvain Stanchina, Bertrand Szelag, Léopold Virot, François Simoens
Publikováno v:
Photonic Instrumentation Engineering IX.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b5b8d8d81070a6c59cb81667c31ab61e
https://doi.org/10.1117/12.2607724
https://doi.org/10.1117/12.2607724
Autor:
Thierry Mourier, Olivier Castany, Patrick Peray, Laura Boutafa, Laurent Mendizabal, J. Auffret, N. Miloud-Ali
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Flip-chip assembly of tin-silver-based microbumps is considered today as a reference process in advanced 3D-packaging heterogeneous integration. Two main paths can be followed in order to perform chip hybridization. Thermo-compression is the referenc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1231eb11df4ed0ffeedc2466cb3f5eeb
https://doi.org/10.1109/ectc32696.2021.00046
https://doi.org/10.1109/ectc32696.2021.00046
Autor:
Mathilde Gottardi, Gilles Romero, Pierre-Emile Philip, Céline Doussot, Sophie Verrun, Thierry Mourier, Gaelle Guittet, Vincent Mevellec
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2019:000077-000103
TSV integration is a key technology allowing heterogeneous devices 3D integration. However, depending on the targeted application, various TSV sizes and integration schemes exist, all requesting very high aspect ratio. The most common integration is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8f4a2006946e837960775a3ef79c7448
https://doi.org/10.4071/2380-4491-2019-dpc-presentation_ta1_061
https://doi.org/10.4071/2380-4491-2019-dpc-presentation_ta1_061
Autor:
Laura Boutafa, Natacha R Aphoz, Patrick Peray, Frédéric Berger, Mireille Francou, Nadia Miloud-Ali, David Henry, Thierry Mourier, Nohora Caicedo, Alain Gueugnot, T. Chaira, Alexis Bedoin, F. Levy, Abdenacer Ait Mani
Publikováno v:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
The continuous evolution of electronic devices has increased a serious concern on 2.5D and 3D advanced packaging. Applications in domains such as displays, automotive, defense or space, require large volumes of interconnects to cover large areas in o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f30c9615ea5f158f21df51701400b615
https://doi.org/10.1109/estc48849.2020.9229685
https://doi.org/10.1109/estc48849.2020.9229685
Autor:
Elisabeth Blanquet, Dean Stephens, Patrice Gergaud, Chris Jones, Thierry Mourier, Sabrina Fadloun, Steve Burgess, Amit Rastogi
Publikováno v:
International Symposium on Microelectronics. 2018:000718-000727
MOCVD (Metal-Organic Chemical Vapor Deposition) copper metallization was developed on 300mm wafers, to fulfil 3D Through-Silicon Via (TSV) interconnect requirements. Using a fluorine-free organometallic precursor, the bis(dimethylamino-2-propoxy)copp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::660df4e05091d3f13ea5a32f624dd2ab
https://doi.org/10.4071/2380-4505-2018.1.000718
https://doi.org/10.4071/2380-4505-2018.1.000718
Autor:
Jean Charbonnier, Pierre Tissier, R. Coquand, Gabriel Pares, Thierry Mourier, Sophie Verrun, R. Franiatte, Stephane Minoret, F. Allain, Mehmet Bicer, Myriam Assous, C. Ribiere
Publikováno v:
69th Electronic Components and Technology Conference
69th Electronic Components and Technology Conference, May 2019, Las Vegas, United States. pp.1622-1628, ⟨10.1109/ECTC.2019.00249⟩
69th Electronic Components and Technology Conference, May 2019, Las Vegas, United States. pp.1622-1628, ⟨10.1109/ECTC.2019.00249⟩
International audience; Micro pillars and micro bumps interconnections are considered as mature technology for 3-D integration and chip stacking. However, in the framework of high-energy particles detection as ATLAS Large Hadron Collider new tracker
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::112192c5ae8aee2a47a8c2ab0b5895a9
https://hal.archives-ouvertes.fr/hal-02475226
https://hal.archives-ouvertes.fr/hal-02475226
Autor:
Mathilde Gottardi, Stephane Minoret, C. Ribiere, Gilles Romero, Thierry Mourier, Pierre-Emile Philip
Publikováno v:
2018 IEEE International Interconnect Technology Conference (IITC).
For many years, TSV has become a key technology driver for 3D integration of heterogeneous devices. Among the different ways to create TSV, mid-process integration places the TSV realization between the front end and back end of line [1][2]. The expa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b126ac245c362d65ab9db8891b2412f1
https://doi.org/10.1109/iitc.2018.8430392
https://doi.org/10.1109/iitc.2018.8430392