Zobrazeno 1 - 1
of 1
pro vyhledávání: '"Thibault Kervyn De Meerendre"'
Autor:
Thibault Kervyn De Meerendre, Adriana Zambova, Ian Bennett, Kees Broek, Brian Chislea, Mario Kloos, John Albaugh, Jason Wei, Guy Beaucarne
Publikováno v:
Energy Procedia. 38:482-487
A new silicone-based Electrically Conductive Adhesive (ECA) has been developed for the Metal Wrap-Through module technology. The ECA has a Ag filler content below 60% but maintains a conductivity after curing below 1mOhmcm. It is flexible over a wide