Zobrazeno 1 - 10
of 12
pro vyhledávání: '"Thibault Buisson"'
Autor:
Maximilien Mathian, Mathieu Chassé, Georges Calas, William L. Griffin, Suzanne Y. O'Reilly, Thibault Buisson, Thierry Allard
Publikováno v:
Palaeogeography, Palaeoclimatology, Palaeoecology
Palaeogeography, Palaeoclimatology, Palaeoecology, 2022, 604, pp.111212. ⟨10.1016/j.palaeo.2022.111212⟩
Palaeogeography, Palaeoclimatology, Palaeoecology, 2022, 604, pp.111212. ⟨10.1016/j.palaeo.2022.111212⟩
International audience; Australia hosts some of Earth’s oldest regolith. They were preserved through geological time thanks to exceptionally low erosion rates affecting large parts of this continent. Accurate chronological constraints about their f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0a4525b7e5bd79446d04846f787cddf0
https://doi.org/10.1016/j.palaeo.2022.111212
https://doi.org/10.1016/j.palaeo.2022.111212
Autor:
Thibault Buisson, S. Kumar
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2017:1-34
Through-silicon vias (TSVs) have now become the preferred interconnect choice for high-end memory. They are also an enabling technology for heterogeneous integration of logic circuits with CIS, MEMS, sensors, and RF filters. In the near future they w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d5ce7a2131b1b734e89ac65a106bb83a
https://doi.org/10.4071/2017dpc-ta1_presentation1
https://doi.org/10.4071/2017dpc-ta1_presentation1
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2016:000707-000750
Demand of lower cost with higher performances has driven the semiconductor industry to develop innovative solutions. One of the new approaches to reduce the overall cost is to switch from wafer to larger size panel format. The panel infrastructure ha
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::309420813f66dcb4a93245fa1e82aa8e
https://doi.org/10.4071/2016dpc-tp21
https://doi.org/10.4071/2016dpc-tp21
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2016:000260-000305
The semiconductor industry is facing a new era in which device scaling and cost reduction will not continue on the path they followed for the past few decades, with Moore's law in its foundation. Advanced nodes do not bring the desired cost benefit a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::911616b5ae71eb86e20b802354773b19
https://doi.org/10.4071/2016dpc-ta11
https://doi.org/10.4071/2016dpc-ta11
Publikováno v:
International Symposium on Microelectronics. 2015:000041-000045
This work focuses on the analysis of recent developments and future trends of organic substrates and 2.5D interposers. In the sub 10 μm line/width space, substrate manufacturers are pushing towards traditionally foundry level Si processing dimension
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1da1b82fbcd8e0d94d77e5e76fc4da13
https://doi.org/10.4071/isom-2015-tp22
https://doi.org/10.4071/isom-2015-tp22
Publikováno v:
International Symposium on Microelectronics. 2015:000001-000005
The semiconductor industry, for more than five decades, has followed Moore's law and was driven by miniaturization of the transistors, scaling the CMOS technology to smaller and more advanced technology nodes while, at the same time, reducing the cos
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::31293fd5c04b423f37b48a1e013c02da
https://doi.org/10.4071/isom-2015-tp11
https://doi.org/10.4071/isom-2015-tp11
Publikováno v:
International Symposium on Microelectronics. 2015:000067-000072
The semiconductor industry is facing a new era in which device scaling and cost reduction will not continue on the path they followed for the past few decades, with Moore's law in its foundation. Advanced nodes do not bring the desired cost benefit a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a2379ae517c3f04c91221a9cc306b1dc
https://doi.org/10.4071/isom-2015-tp31
https://doi.org/10.4071/isom-2015-tp31
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2015:000182-000216
Embedded packages are nowadays not anymore just an interesting approach for some specific application. Benefiting from 3D TSV high cost, and consequently delays, these packages could fit the high expectations of the industry. Indeed, added value of e
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6e01eff7a44bd273794eeba2feb1f30c
https://doi.org/10.4071/2015dpc-ta21
https://doi.org/10.4071/2015dpc-ta21
Publikováno v:
ECS Transactions. 61:11-16
3D Packaging Technologies and Applications, Latest Challenges and Supply Chain Activities Semiconductor industry, for more than four decades, has rigorously followed Moore's Law in scaling down the CMOS technologies. Although several new materials an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::efa9239798d26fb31bbfdc5446d3460d
https://doi.org/10.1149/06106.0011ecst
https://doi.org/10.1149/06106.0011ecst
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2014:000363-000400
Semiconductor industry, for more than four decades, has rigorously followed Moore's Law in scaling down the CMOS technologies. Although several new materials and processes are being developed to address the challenges of future technology nodes, in t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::202f1250f40ad4b5c5ec7e3f8ed86355
https://doi.org/10.4071/2014pdc/ta11
https://doi.org/10.4071/2014pdc/ta11