Zobrazeno 1 - 10
of 50
pro vyhledávání: '"Thiam Beng Lim"'
Autor:
Thiam Beng Lim, Ee Hua Wong
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 31:54-64
Thermal stress due to mismatched coefficients of thermal expansion is a problem that has challenged the electronics packaging industry for decades. Analytical solutions are available in the literatures for a tri-material in which the sandwiched layer
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::97e9eb968972b06925761c95b6bb57a1
https://doi.org/10.1109/tcapt.2007.906730
https://doi.org/10.1109/tcapt.2007.906730
Publikováno v:
IEEE Transactions on Advanced Packaging. 30:654-664
Closed form analytical solutions for the stresses in the interconnects between the integrated circuit (IC) package and the printed circuit board (PCB) when the PCB assembly is subjected to a mechanical shock have been developed and validated. The sol
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::72edfa2964dd903b2707f6112ef6b7ef
https://doi.org/10.1109/tadvp.2007.898599
https://doi.org/10.1109/tadvp.2007.898599
Publikováno v:
IEEE Transactions on Advanced Packaging. 29:751-759
Two advanced techniques have been developed for modeling vapor pressure within the plastic IC packages during solder reflow. The first involves the extension of the "wetness" technique to delamination along multimaterial interface and during dynamic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3a6f43bd681b664424298510435e91bc
https://doi.org/10.1109/tadvp.2006.879423
https://doi.org/10.1109/tadvp.2006.879423
Publikováno v:
Journal of Electronic Packaging. 124:122-126
A reliable technique for characterizing the hygroscopic swelling of materials has been developed and used to characterize a number of packaging materials. Using these data, hygroscopic stress modeling were performed. The hygroscopic stress induced th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::066be6c647c098560759319a6f5bf762
https://doi.org/10.1115/1.1461367
https://doi.org/10.1115/1.1461367
Publikováno v:
Polymer. 42:6409-6418
Surface modification of poly(tetrafluoroethylene) (PTFE) film by H2 plasma treatment, and by plasma polymerization and deposition of glycidyl methacrylate (GMA) in the absence and presence of H2 plasma pre-activation of the PTFE substrates, was carri
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::df75ca1963583f4fa6c2668525af680d
https://doi.org/10.1016/s0032-3861(01)00113-6
https://doi.org/10.1016/s0032-3861(01)00113-6
Publikováno v:
Polymers for Advanced Technologies. 12:583-595
Thin polymer films were deposited on Si(100) surfaces by plasma polymerization of glycidyl methacrylate (GMA) under different glow discharge conditions. The FT-IR, X-ray photoelectron spectroscopy (XPS), and amine treatment results suggested that the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d7e6b714157154c694cd68246737bf2b
https://doi.org/10.1002/pat.146
https://doi.org/10.1002/pat.146
Publikováno v:
Scopus-Elsevier
An epoxy/PTFE composite was prepared by curing the epoxy resin on the surface-modified PTFE film. Surface modification of PTFE films was carried out via argon plasma pretreatment, followed by UV-induced graft copolymerization with glycidyl methacryla
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::56700115cb492bd13805fc3cb180ea37
https://doi.org/10.1080/00218460008029588
https://doi.org/10.1080/00218460008029588
Publikováno v:
Scopus-Elsevier
Further modification of self-assembled monolaycrs (SAMs) on gold via argon plasma-treatment and then UV-induced graft polymerization with functional monomers has been carried out Two alkanethiols. viz., 3-mercaptopropionic acid (MPA) and 3-mercaptopr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::32158a86bda89cd3221aced31f30d5c1
https://doi.org/10.1002/1521-3935(20000901)201:14<1653::aid-macp1653>3.0.co
https://doi.org/10.1002/1521-3935(20000901)201:14<1653::aid-macp1653>3.0.co
Publikováno v:
Soldering & Surface Mount Technology. 12:37-41
The impact of underfill properties on the thermomechanical reliability of flip chip on board (FCOB) assembly is addressed in this paper. FCOB assemblies using three underfill encapsulants were subjected to a thermal cycling test. The performance of t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dac500e2d4514512d457ded8f80d5fb3
https://doi.org/10.1108/09540910010331455
https://doi.org/10.1108/09540910010331455
Publikováno v:
International Journal of Adhesion and Adhesives. 20:165-171
The lamination of a glass fibre-reinforced and epoxy-based printed circuit board (PCB) substrate, FR-4®, to an amorphous thermoplastic copolyester of dimethyl terephthalate with ethylene glycol and 1,4-cyclohexanedimethanol, PETG®, was studied. The
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0a344dd8109f1343d5e1ce8e44601d51
https://doi.org/10.1016/s0143-7496(99)00037-8
https://doi.org/10.1016/s0143-7496(99)00037-8