Zobrazeno 1 - 10
of 1 467
pro vyhledávání: '"Thermocompression bonding"'
Publikováno v:
Journal of Materials Research and Technology, Vol 26, Iss , Pp 3701-3709 (2023)
High-quality bonding of microfluidic chips is essential for driving the rapid marketization of microfluidic devices. While thermocompression bonding is known for its simplicity, challenges such as high deformation and low bond strength persist. In th
Externí odkaz:
https://doaj.org/article/aca96ec56d984fc693e8fab6455fcf08
Publikováno v:
Journal of Materials Research and Technology, Vol 24, Iss , Pp 639-652 (2023)
Thermoplastic microfluidic chips show broad development prospects in biomedicine, point-of-care testing, healthcare, environmental monitoring, etc. However, improving the production efficiency of microfluidic chips remains a key industrial challenge
Externí odkaz:
https://doaj.org/article/10a11c1c4d854b9786f3d0f144092b94
Akademický článek
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Akademický článek
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Publikováno v:
Archives of Metallurgy and Materials, Vol vol. 66, Iss No 4, Pp 963-966 (2021)
The Sn-Ag-Cu-based solder paste screen-printing method has primarily been used to fabricate Bi2Te3-based thermoelectric (TE) modules, as Sn-based solder alloys have a low melting temperature (approximately 220℃) and good wettability with Cu electro
Externí odkaz:
https://doaj.org/article/fcc2cd81e1014c4fabdc2f782b0d810d
Autor:
Sylwester Bargiel, Julien Cogan, Samuel Queste, Stefania Oliveri, Ludovic Gauthier-Manuel, Marina Raschetti, Olivier Leroy, Stéphan Beurthey, Mathieu Perrin-Terrin
Publikováno v:
Micromachines, Vol 14, Iss 7, p 1297 (2023)
Silicon-based microchannel technology offers unmatched performance in the cooling of silicon pixel detectors in high-energy physics. Although Si–Si direct bonding, used for the fabrication of cooling plates, also meets the stringent requirements of
Externí odkaz:
https://doaj.org/article/78d5f37d0acb4741b25282be3576b01a
Autor:
Maria Lykova, Iuliana Panchenko, Martin Schneider-Ramelow, Tadatomo Suga, Fengwen Mu, Roy Buschbeck
Publikováno v:
Micromachines, Vol 14, Iss 7, p 1365 (2023)
Cu-Cu direct interconnects are highly desirable for the microelectronic industry as they allow for significant reductions in the size and spacing of microcontacts. The main challenge associated with using Cu is its tendency to rapidly oxidize in air.
Externí odkaz:
https://doaj.org/article/1003d249e5914bbe8877ab2a21af7e00
Akademický článek
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Autor:
Buschbeck, Maria Lykova, Iuliana Panchenko, Martin Schneider-Ramelow, Tadatomo Suga, Fengwen Mu, Roy
Publikováno v:
Micromachines; Volume 14; Issue 7; Pages: 1365
Cu-Cu direct interconnects are highly desirable for the microelectronic industry as they allow for significant reductions in the size and spacing of microcontacts. The main challenge associated with using Cu is its tendency to rapidly oxidize in air.
Autor:
Perrin-Terrin, Sylwester Bargiel, Julien Cogan, Samuel Queste, Stefania Oliveri, Ludovic Gauthier-Manuel, Marina Raschetti, Olivier Leroy, Stéphan Beurthey, Mathieu
Publikováno v:
Micromachines; Volume 14; Issue 7; Pages: 1297
Silicon-based microchannel technology offers unmatched performance in the cooling of silicon pixel detectors in high-energy physics. Although Si–Si direct bonding, used for the fabrication of cooling plates, also meets the stringent requirements of