Zobrazeno 1 - 10
of 4 042
pro vyhledávání: '"Thermal engineering"'
Publikováno v:
Takasago Thermal Engineering Co., Ltd. MarketLine Company Profile. 10/26/2023, p1-19. 19p.
Publikováno v:
Entrepreneur. Mar/Apr2024, Vol. 52 Issue 2, p64-65. 2p. 3 Color Photographs, 1 Black and White Photograph.
Autor:
Su, Haotian, Kwon, Heungdong, Hwang, William, Xue, Fen, Köroğlu, Çağıl, Tsai, Wilman, Asheghi, Mehdi, Goodson, Kenneth E., Wang, Shan X., Pop, Eric
Publikováno v:
Journal of Applied Physics; 7/7/2024, Vol. 136 Issue 1, p1-10, 10p
Autor:
Ma, Linjie1 (AUTHOR), Zhang, Jiahua1 (AUTHOR), Hao, Zheng2 (AUTHOR), Jing, Jixiang1 (AUTHOR), Zhang, Tongtong1 (AUTHOR), Lin, Yuan2 (AUTHOR), Chu, Zhiqin1,3 (AUTHOR) zqchu@eee.hku.hk
Publikováno v:
Advanced Optical Materials. Sep2024, p1. 9p. 6 Illustrations.
Autor:
Shiga, Takuma1 (AUTHOR) takuma.shiga@aist.go.jp, Minamitani, Emi2,3 (AUTHOR) eminamitani@sanken.osaka-u.ac.jp, Yamashita, Yuichiro1,4 (AUTHOR), Yagi, Takashi1,4 (AUTHOR), Taketoshi, Naoyuki1,4 (AUTHOR), Shigesato, Yuzo4 (AUTHOR), Kashiwagi, Makoto4 (AUTHOR) kashiwagi@chem.aoyama.ac.jp
Publikováno v:
Applied Physics Letters. 7/1/2024, Vol. 125 Issue 1, p1-6. 6p.
Autor:
Pavlidis, G.1,2 (AUTHOR) georges.pavlidis@uconn.edu, Jamil, M. S.1 (AUTHOR), Myren, D.1 (AUTHOR), Keebaugh, S.3 (AUTHOR), Chang, J.3 (AUTHOR), Doerflein, M.3 (AUTHOR), Afroz, S.3 (AUTHOR), Howell, R. S.3 (AUTHOR), Centrone, A.2 (AUTHOR)
Publikováno v:
Applied Physics Letters. 7/1/2024, Vol. 125 Issue 1, p1-5. 5p.
Publikováno v:
Takasago Thermal Engineering Co., Ltd. MarketLine Company Profile. 11/7/2022, p1-20. 20p.
Autor:
Wang, Jianxiu1,2 (AUTHOR) wang_jianxiu@163.com, Liu, Pengfei1 (AUTHOR), Hu, Jian1 (AUTHOR), Pan, Weiqiang3 (AUTHOR), Long, Yanxia1 (AUTHOR), Cao, Ansheng1 (AUTHOR), Li, Huboqiang1 (AUTHOR), Sun, Yuanwei1 (AUTHOR)
Publikováno v:
Materials (1996-1944). Feb2023, Vol. 16 Issue 3, p1052. 21p.
Autor:
Jawad, Muhammad1 (AUTHOR), Alam, Mubeen1 (AUTHOR), Hameed, Maria Kirn2 (AUTHOR), Akgül, Ali3,4 (AUTHOR) aliakgul00727@gmail.com
Publikováno v:
Journal of Thermal Analysis & Calorimetry. Jun2024, Vol. 149 Issue 11, p5809-5822. 14p.
Autor:
Khan, Mahwish1 (AUTHOR), Wang, Hongchao1 (AUTHOR) wanghc@sdu.edu.cn, Wang, Chunlei1 (AUTHOR) wangcl@sdu.edu.cn
Publikováno v:
Physica Status Solidi - Rapid Research Letters. Jun2024, Vol. 18 Issue 6, p1-9. 9p.