Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Thermal characterization of dielectric"'
The objective of the proposed research is to design, implement, and characterize low-cost, lightweight front-end components and subsystems in the microwave domain through innovative packaging architectures for remote sensing applications. Particular
Externí odkaz:
http://hdl.handle.net/1853/47532
The objective of the proposed research is to design, implement, and characterize low-cost, lightweight front-end components and subsystems in the microwave domain through innovative packaging architectures for remote sensing applications. Particular
Externí odkaz:
http://hdl.handle.net/1853/51733