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pro vyhledávání: '"Thassilo Lang"'
Autor:
Rafat Saleh, Sophie Schütt, Maximilian Barth, Thassilo Lang, Wolfgang Eberhardt, André Zimmermann
Publikováno v:
Micromachines, Vol 13, Iss 8, p 1240 (2022)
The assembly of passive components on flexible electronics is essential for the functionalization of circuits. For this purpose, adhesive bonding technology by isotropic conductive adhesive (ICA) is increasingly used in addition to soldering processe
Externí odkaz:
https://doaj.org/article/9bbe592613de49aa89e40cdbadcb7f84
