Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Thangali Seshadri"'
Publikováno v:
Journal of Electronics Manufacturing. :101-107
The semiconductor industry is constantly looking for cleaner and safer methods of handling and transporting semiconductor wafers during manufacturing. This paper describes research on the use of levitation to handle and move wafers. An articulated ar
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a13e8718a568342936d62bac9f02a21e
https://doi.org/10.1142/s0960313192000133
https://doi.org/10.1142/s0960313192000133
Autor:
Thangali, Seshadri R.
Publikováno v:
IndraStra Global.
Semiconductor wafer manufacturing involves many processing steps. During manufacturing, the wafer is transferred from one processing chamber to another by wafer handling equipment. Also the environment encountered by the wafer can vary from high vacu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=issn23813652::ce1c49669f4fb2d172a3f5468c245bb0
https://igi.indrastra.com/items/show/105764
https://igi.indrastra.com/items/show/105764