Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Thamyres C. Carvalho"'
Autor:
Maria das Graças da Silva-Valenzuela, Thamyres C. Carvalho, Antônio Hortencio Munhoz Junior, Francisco Rolando Valenzuela-Díaz, Margarita Bobadilla
Publikováno v:
The Minerals, Metals & Materials Series ISBN: 9783030057480
Between the most used clays in industrial applications are the bentonites. They are used as additives for drilling fluids, binders for foundry sands and minerals ores and as pet litter sands. Due to the mechanical and thermal properties that they fur
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8e4ea212c892fbf48ae636e8926adbef
https://doi.org/10.1007/978-3-030-05749-7_42
https://doi.org/10.1007/978-3-030-05749-7_42
Autor:
Camila N. Maggi, Thamyres C. Carvalho, R. F. Neves, Francisco Rolando Valenzuela-Díaz, Edemarino Araujo Hildebrando, Margarita Bobadilla
Publikováno v:
The Minerals, Metals & Materials Series ISBN: 9783030057480
Smectite clay minerals are important materials for a wide variety of applications such as ceramics, polymer/clay nanocomposites, adsorbents, catalysts, among others. Stevensite clay is a smectite with good properties, but there are few natural deposi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d84835bd43034c62cbfc11f1426680d0
https://doi.org/10.1007/978-3-030-05749-7_49
https://doi.org/10.1007/978-3-030-05749-7_49
Autor:
Thamyres C. Carvalho, Francisco Rolando Valenzuela-Díaz, Roberto F. Neves, Edemarino Araujo Hildebrando
Publikováno v:
The Minerals, Metals & Materials Series ISBN: 9783319724836
Synthetic clays are an option of materials that can be modified to obtain better and specific properties when compared with natural clays. Although clays are found in nature, they have many disadvantages that limit the use of them, such as existence
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::125d0fc8151d27d9658aad9052fbb434
https://doi.org/10.1007/978-3-319-72484-3_50
https://doi.org/10.1007/978-3-319-72484-3_50