Zobrazeno 1 - 10
of 46
pro vyhledávání: '"Tetsuya Enomoto"'
Publikováno v:
Journal of Photopolymer Science and Technology. 35:153-159
Autor:
Emi Miyazawa, Tetsuya Enomoto, Yuta Akasu, Shogo Sobue, Yuki Nakamura, Saeko Ogawa, Takashi Kawamori
Publikováno v:
2023 International Conference on Electronics Packaging (ICEP).
Autor:
Furutani Ryoji, Sobue Shogo, Emi Miyazawa, Tetsuya Enomoto, Yuki Nakamura, Akasu Yuta, Takashi Kawamori, Oyama Yasuyuki
Publikováno v:
International Symposium on Microelectronics. 2020:000302-000306
We have developed a new temporary bonding film (TBF) and new debonding system with Xe flash light irradiation, named photonic release system, for advanced package assembly process. Since new TBF has a high Tg over 200 °C after curing and shows good
Autor:
Naoto Nagami, Tetsuya Enomoto, Daisaku Matsukawa, Takeharu Motobe, Nobuyuki Saito, Kohei Mizuno
Publikováno v:
International Symposium on Microelectronics. 2019:000042-000045
We have newly developed non photosensitive and photosensitive polyimide having excellent electrical/mechanical properties. At first we have re-designed the polymer backbone in order to obtain low Dk and Df performance. As a result, our new non photos
Autor:
Hiroto Imai, Ryouichi Tominaga, Ken Shimoda, Yasushi Matsumoto, Keiichiro Suwa, Shigeru Kose, Mutsuma Adachi, Junichi Obata, Tatsuya Miki, Toshio Masahira, Kazuyoshi Korosue, Tomoya Hiura, Shogo Tamura, Narihide Shinoda, Tetsuya Enomoto, Eiji Kohmura, Masafumi Mori
Publikováno v:
Journal of Neuroendovascular Therapy. 13:221-227
Autor:
Hiroko Yotsuyanagi, Daisaku Matsukawa, Tetsuya Enomoto, Takeharu Motobe, Noriyuki Yamazaki, Shiori Sakakibara
Publikováno v:
International Symposium on Microelectronics. 2018:000508-000511
Hitachi Chemical DuPont MicroSystems (HDMS) has been developing photo sensitive negative-tone polyimides (PIs) as dielectrics for re-distribution layers (RDLs) in wafer level packages (WLPs) and as protection layers in semiconductor ICs. Photo sensit
Publikováno v:
Journal of Photopolymer Science and Technology. 31:451-456
Autor:
Masato Nishimura, Daisaku Matsukawa, Tetsuya Enomoto, Masayuki Ohe, Nakamura Tadamitsu, Noriyuki Yamazaki, Takeharu Motobe
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2017:1-15
Photo-definable polyimides (PI) and polybenzoxazoles (PBO) have been widely used as dielectrics for re-distribution layers in wafer level chip size packages (WL-CSP). These materials can simplify the manufacturing process and ensure high reliability
Autor:
Tetsuya Enomoto, Takeharu Motobe, Noriyuki Yamazaki, Hiroko Yotsuyanagi, Daisaku Matsukawa, Shiori Sakakibara
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
A novel polyimide (PI) with improved shrinkage and lithographic performance was developed by re-designing key components of the formulation. It should be noted that this PI, due to lower shrinkage during cure, can achieve a flatter surface as compare
Autor:
Tetsuya Enomoto, Nakamura Tadamitsu, Nobuyuki Saito, Daisaku Matsukawa, Masayuki Ohe, Takeharu Motobe, Abe Satoshi, Noriyuki Yamazaki
Publikováno v:
2017 International Conference on Electronics Packaging (ICEP).
Hitachi Chemical DuPont MicroSystems (HDMS) has been developing photosensitive negative-tone polyimides (PI) and positive-tone poly(benzoxazole)s (PBO) for use as protection layers in semiconductor ICs or as dielectrics for re-distribution layers in