Zobrazeno 1 - 10
of 73
pro vyhledávání: '"Tetsuya, Koyama"'
Autor:
Remi Kodera, Kazuya Fujihara, Tetsuya Koyama, Haruka Shiozaki, Yurie Mutsuma, Noriko Yagyuda, Mariko Hatta, Kahori Tsuruoka, Yasunada Takeda, Atsushi Araki, Hirohito Sone
Publikováno v:
Scientific Reports, Vol 13, Iss 1, Pp 1-8 (2023)
Abstract We examined the impact of a history of coronary artery disease (CAD) or cerebrovascular disease (CVD) and physical activity habits on functional disability among community-dwelling Japanese adults. This population-based retrospective cohort
Externí odkaz:
https://doaj.org/article/09492a7d470a4e2983736c7ce584e7f5
Publikováno v:
Folia Pharmacologica Japonica. 158:203-210
Publikováno v:
Electronic Journal of Differential Equations, Vol 2009, Iss 62,, Pp 1-8 (2009)
The aim of this note is to investigate a time-discretized 2-dimensional Navier-Stokes equation with a slip-like boundary condition, which arises in the melting ice problem. We prove the existence and uniqueness of a weak solution.
Externí odkaz:
https://doaj.org/article/916642c73a04458abeee5e0167759b00
Autor:
Daisuke Murakami, Takashi Nakagawa, Yusuke Miyamoto, Tetsuya Koyama, Hirofumi Omori, Kaname Miyashita, Motohiro Sawatsubashi
Publikováno v:
Journal of Clinical and Experimental Hematopathology : JCEH
The present study investigated histological subtypes of lymphoma in patients newly diagnosed with malignant lymphoma in the human T-cell leukemia virus type 1 (HTLV-1) endemic area of Japan, and further analyzed the clinicopathological features and c
Autor:
Akira Kurose, Akihiko Kawahara, Hiroshi Harada, Mizue Sato, Michiko Ehara, Tetsuya Koyama, Seiya Kato, Yusuke Miyamoto
An extremely exceptional case of salivary duct carcinoma (SDC) arising from pre-existing epithelial-myoepithelial carcinoma (EMC) of the parotid gland is herein described. The patient was a 50-year-old Japanese female, who presented with an asymptoma
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::72ba929ef3c92f7828d7d1f57a964aa1
https://zenodo.org/record/4527840
https://zenodo.org/record/4527840
Publikováno v:
International Symposium on Microelectronics. 2017:000715-000720
As mobility products, such as smart phones, tablets and wearable devices, continue on the paths of both miniaturization and high performance, components and packaging are likewise driven to become smaller and thinner. In mobile devices, a thinner pac
Publikováno v:
International Symposium on Microelectronics. 2016:000001-000006
The current trend in the electronics industry is one of increased computing performance, combined with a seemingly unending demand for portability and increased miniaturization; this is especially evident in the significant changes to the semiconduct
Autor:
Ryoko Tokuda, Hiromitsu Takayama, Yoshiki Okamoto, Tetsuya Koyama, Noriyuki Kogure, Mariko Kitajima
Publikováno v:
Organic Letters. 18:3490-3493
A new monoterpenoid indole alkaloid, kopsiyunnanine K, was isolated from Kopsia arborea. Its intriguing rearranged structure and absolute configuration, which were inferred from spectral data and a possible biosynthetic pathway, were determined on th
Autor:
Billy Ahn, Anthony D. Yang, Yonghyuk Jeong, Takahiro Horie, Tetsuya Koyama, Masahiro Tsuriya, Jim Hsu, Jeffrey E. Lee, Kiyoshi Oi
Publikováno v:
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).
SiP turns to be complex due to increasing the number of components in a given space, narrow gap between die-to-passive or passive-to-passive and narrow clearance between mold top to components. Therefore, molding process becomes a critical process to
Autor:
Billy Ahn, Tetsuya Koyama, Takahiro Horie, Masahiro Tsuriya, Yonghyuk Jeong, Anthony D. Yang, Jeffrey E. Lee, Jim Hsu, Kiyoshi Oi
Publikováno v:
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).
Warpage is one big challenge during manufacturing process for advanced packaging, which needs to be addressed for successful process integration. For these challenges, iNEMI has initiated System-in-Package module warpage project which is to understan