Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Tetsuro Iwakura"'
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0eaa8c7db5a23ef9500ec773e3693a6e
https://doi.org/10.1109/ectc51906.2022.00142
https://doi.org/10.1109/ectc51906.2022.00142
Publikováno v:
2016 International Conference on Electronics Packaging (ICEP).
The new ultra-low loss build-up film has been developed by the combination of the matrix layer, which has the semi-IPN structure, and the primer layer. The matrix material was designed and prepared by the original polymer blend modification technolog
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d63b98ae840ed6313453efa2a436ca77
https://doi.org/10.1109/icep.2016.7486779
https://doi.org/10.1109/icep.2016.7486779
Publikováno v:
e-Journal of Soft Materials. 2:13-19
The advancement in the miniaturization of electric devices requires high performance diebond adhesive films for semiconductor packages. The diebond film should have high thermal-stress resistance and good retention of adhesive properties. To achieve
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3ff9b0a8db86ade15524a895deaa024f
https://doi.org/10.2324/ejsm.2.13
https://doi.org/10.2324/ejsm.2.13
Autor:
Tetsuro Iwakura, Fujimoto Daisuke, Hikari Murai, Yamada Kumpei, Youichi Kaneko, Hiroshi Simizu
Publikováno v:
2013 3rd IEEE CPMT Symposium Japan.
As electronic parts increase its performance and miniaturize the size, package substrates are demanded to be thinner as well as higher in density. Thin packages such as Chip Scale Package (CSP) require high elastic modulus and low coefficient of ther
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1c6746a03d3dc8ad5b7d814d57de0899
https://doi.org/10.1109/icsj.2013.6756078
https://doi.org/10.1109/icsj.2013.6756078
Autor:
Kiyohito Koyama, Hideyuki Uematsu, Masataka Sugimoto, Takashi Taniguchi, Teiichi Inada, Tetsuro Iwakura, Albert Co, Gary L. Leal, Ralph H. Colby, A. Jeffrey Giacomin
Publikováno v:
AIP Conference Proceedings.
Uniaxial elongational flow behavior of polymer blend system containing three components (acrylic polymer, epoxy resin and SiO2) was investigated. The strain softening was observed at 80 °C and the strain hardening was observed at 60 °C for the same
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5648f61450bd0e42574f24de9865b34b
https://doi.org/10.1063/1.2964752
https://doi.org/10.1063/1.2964752