Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Tetsuro Irino"'
Publikováno v:
2016 International Conference on Electronics Packaging (ICEP).
The new ultra-low loss build-up film has been developed by the combination of the matrix layer, which has the semi-IPN structure, and the primer layer. The matrix material was designed and prepared by the original polymer blend modification technolog
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d63b98ae840ed6313453efa2a436ca77
https://doi.org/10.1109/icep.2016.7486779
https://doi.org/10.1109/icep.2016.7486779
Autor:
Shin Takanezawa, Hikari Murai, Masato Miyatake, Tomohiko Kotake, Masaaki Takekoshi, Taro Momozaki, Tetsuro Irino, Koji Morita
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 13:367-370
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::79dfc93c0b41633221835a89f5bb4031
https://doi.org/10.5104/jiep.13.367
https://doi.org/10.5104/jiep.13.367
Autor:
Tetsuro Irino
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 2:440-445
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b6c5a9971867988289ca296d8b2c8d76
https://doi.org/10.5104/jiep.2.440
https://doi.org/10.5104/jiep.2.440
Publikováno v:
Circuit Technology. 7:322-333
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8c6f27d16c9af4863ac4a8c770536edb
https://doi.org/10.5104/jiep1986.7.322
https://doi.org/10.5104/jiep1986.7.322
Publikováno v:
Circuit Technology. 7:386-401
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6e237db8e57161574be8c555e3efd6b2
https://doi.org/10.5104/jiep1986.7.386
https://doi.org/10.5104/jiep1986.7.386