Zobrazeno 1 - 10
of 38
pro vyhledávání: '"Teruhisa Akashi"'
Autor:
Motohiro Fujiyoshi, Atsushi Kawamoto, Shoji Hashimoto, Yoshiteru Omura, Hirofumi Funabashi, Yoshie Ohira, Yoshiyuki Hata, Takashi Ozaki, Teruhisa Akashi, Yutaka Nonomura, Takahiro Nakayama, Hitoshi Yamada
Publikováno v:
IEEE Sensors Journal. 22:3965-3973
Autor:
Yutaka Nonomura, Hiroko Iguchi, Teruhisa Akashi, Kanae Hamaguchi, Keiichi Shimaoka, Norio Fujitsuka, Isao Aoyagi, Takashi Ozaki
Publikováno v:
Journal of the Japan Society for Precision Engineering. 85:1005-1012
Autor:
Hiroko Iguchi, Hirofumi Funabashi, Hidehito Matsuo, Teruhisa Akashi, Toshihiko Tani, Shigeo Hori
Publikováno v:
Journal of the European Ceramic Society. 37:4773-4779
Control of the crystallization and orientation of apatite-type lanthanum silicate (LSO) plays an important role in designing and improving the LSO synthesis process. The mechanisms that determine the c -axis preferential orientation of LSO thin films
Autor:
Yoshiteru Omura, Yoshiyuki Hata, Motohiro Fujiyoshi, Shuji Tanaka, Teruhisa Akashi, Takahiro Nakayama, Hirofumi Funabashi, Masanori Muroyama, Yutaka Nonomura
Publikováno v:
Sensors and Actuators A: Physical. 266:24-35
This paper reports a microelectromechanical systems (MEMS) tactile sensor with a quad-seesaw-electrode (QSE) structure, which allows integration with a CMOS substrate. The QSE structure enables fully-differential detection and 3-axis force detection
Autor:
Motohiro Fujiyoshi, Yutaka Nonomura, Hirofumi Funabashi, Yoshiteru Omura, Teruhisa Akashi, Takashi Ozaki
Publikováno v:
Journal of Micromechanics and Microengineering. 31:045001
Silicon-on-insulator (SOI) wafers are used in many micro-electromechanical system (MEMS) devices because of their stable mechanical properties. However, one of the disadvantages of using the SOI configuration is residual stress deformation; strong re
Autor:
Yoshiyuki Hata, Yoshiteru Omura, Motohiro Fujiyoshi, Hirofumi Funabashi, Teruhisa Akashi, Hideki Takagi
Publikováno v:
2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS).
Long-term hermetic vacuum wafer-level packaging (WLP) by bonding with copper-tin (CuSn) thin films is presented. By improving the pretreatment of bonding, the shear strength reached 74 MPa on average with a CuSn 150-μm-wide seal frame. Furthermore,
Publikováno v:
Sensors and Actuators A: Physical. 215:130-135
We developed a topology optimization method for designing a two-dimensional (2D) photomask. The optimization employs multistep mapping compatible with micromachining processes to improve the characteristics of a three-dimensional (3D) MEMS fabricated
Autor:
Yutaka Nonomura, Takahiro Nakayama, Yoshiyuki Hata, Yoshiteru Omura, Masayoshi Esashi, Hirofumi Funabashi, Teruhisa Akashi, Motohiro Fujiyoshi
Publikováno v:
Procedia Engineering. 47:546-549
We developed a fully-differential 3-axis accelerometer with a Zigzag-Shaped Z-electrode (ZSZ) for motion controls of automobiles and robots. The ZSZ structure is composed of only two silicon layers of an SOI (Silicon-on-Insulator) wafer. The ZSZ stru
Publikováno v:
Journal of Micromechanics and Microengineering. 28:044002
A wafer-level hermetic vacuum packaging technology intended for use with MEMS devices was developed based on a copper–tin (CuSn) thin film sealing ring. To allow hermetic packaging, the shear strength of the CuSn thin film bond was improved by opti
Autor:
Motohiro Fujiyoshi, Yutaka Nonomura, Teruhisa Akashi, Yoshiyuki Hata, Yoshiteru Omura, Hirofumi Funabashi
Publikováno v:
2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS).
We report a detuned 2-axis yaw-and-roll gyroscope with a single sensor element. We designed and fabricated a novel structure composed of a synchronously driven dual mass and three types of supporting beams to limit the movable direction of each mass.