Zobrazeno 1 - 10
of 17
pro vyhledávání: '"Terry Patrick Bowen"'
Autor:
Willy Rietveld, Norbert Meier, Bert Jan Offrein, Terry Patrick Bowen, Jonas R. Weiss, Stefano S. Oggioni, Bill Herb, Dave Cormany, Rutger Wilhelmus Smink, Cor Spoor, Jeroen Antonius Maria Duis, Daniel Jubin, Sander Dorrestein
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 7:1249-1257
We present a versatile electro-optical packaging platform for optical transceiver modules suitable for very high aggregate I/O capacity, as required, for example, in (disaggregated) datacenters and servers. Real-estate limitations on the board or on
Autor:
Yuming Song, Tony Contreras, Jian Wang, Terry Patrick Bowen, Mingjie Fan, Srikrishna Sitaraman, Shaoyong Wang
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
In this paper, a low-cost solution to miniaturize systems at the board-level is demonstrated using a novel embedding scheme. The miniaturization concept is demonstrated using a state-of-the-art contact-less power module for low-power house-hold appli
Publikováno v:
2016 Pan Pacific Microelectronics Symposium (Pan Pacific).
Over the past decade, the silicon photonics industry has made fantastic progress in implementing a wide range of optical and electro-optical devices using infrastructure and low-cost, high-volume, manufacturing technologies from the microelectronics
Autor:
Haipeng Zhang, Terry Patrick Bowen, Gee-Kung Chang, Bruce C. Chou, Venky Sundaram, Vanessa Smet, Jibin Sun, Rao Tummala, Sandeep Razdan
Publikováno v:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
This paper presents the modeling, design, and demonstration of an ultra-miniaturized 2.5D optical transceiver module using ultra-thin glass interposers with electrical and optical through vias. The 3D Glass Photonics (3DGP) technology with double sid
Publikováno v:
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
The throughput of die bonding machines, required to provide precise assembly alignment, is inversely and exponentially proportional to the accuracy required. Optoelectronic throughputs are much lower than pick and place assembly system throughputs du
Autor:
R. Roff, John R. Rowlette, James E. Morris, Terry Patrick Bowen, Jared D. Stack, Michael R. Feldman, W.H. Welch
Publikováno v:
Proceedings of LEOS '93.
A key barrier to market penetration of optics into the electronic marketplace for a wide range of applications is cost. One of the advantages of computer generated holograms is the low fabrication cost based on VLSI processing technology. In addition
Publikováno v:
1994 Proceedings. 44th Electronic Components and Technology Conference.
In this paper we report our experimental results about etching defects and microscopic surface roughness on potassium hydroxide (KOH) etched [100] silicon. We have studied the formation and morphology of etch hillock defects during the anisotropic et
Publikováno v:
Conference Proceedings. LEOS'98. 11th Annual Meeting. IEEE Lasers and Electro-Optics Society 1998 Annual Meeting (Cat. No.98CH36243).
Optical circuits based on low-loss glass waveguide are a practical and promising approach to integrating different functional components for optical communication systems. Microwave plasma assisted chemical vapor deposition (MPACVD) produces superior
Publikováno v:
Conference Proceedings. LEOS '97. 10th Annual Meeting IEEE Lasers and Electro-Optics Society 1997 Annual Meeting.
The advancement of fiber optics and optoelectronics has dramatically increased the bandwidth for communication. In order to serve interactive and multimedia needs, one-way cable television distribution systems will soon move into the two-way telecomm
Autor:
C. Stirk, R. Tekolste, J. Wilgus, J. Schramm, A. Baliga, M. Saroya, J. Radcliffe, T. Hoot, D. Bowler, Yung-Cheng Lee, Hongtao Han, Terry Patrick Bowen, C. Drabenstadt, Songshen Tan, C. Armiento, B. Hookier, Michael R. Feldman, J. Mathews, N. Delen, Ping Zhou, Robert Addison Boudreau
Publikováno v:
Conference Proceedings. LEOS '97. 10th Annual Meeting IEEE Lasers and Electro-Optics Society 1997 Annual Meeting.
This paper is a review of the present status of an ARPA sponsored program to develop low cost serial links. In particular, this team has focused its efforts on the development of bi-directional links which offer the special feature of sending informa