Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Terry Ku"'
Autor:
Douglas C. H. Yu, Chuei-Tang Wang, Chia-Chia Lin, Chih-Hsin Lu, Gene Wu, Chien-Yuan Huang, Wei-Ting Chen, Terry Ku, Kuo-Chung Yee, Chung-Hao Tsai
Publikováno v:
IEEE Transactions on Electron Devices. 69:7167-7172
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
5G and AI technologies are widely applied to highly connected world across cloud, network and edge applications. The compute and bandwidth of high performance computing (HPC) systems such as supercomputer, data center and high-end servers are constan
Publikováno v:
2020 IEEE Symposium on VLSI Technology.
A low temperature system-on-integrated-chip (SoIC) bonding and stacking technology is proposed and implemented for 3-D memory integration, such as 3-D static random access memory (SRAM) or dynamic random access memory (DRAM) cube. It extends not only
Autor:
Terry Ku, Tsung-Shu Lin, Jeng-Shien Hsieh, Chun Shu-Rong, Douglas Yu, Hao-Yi Tsai, Chung-Shi Liu, Tin-Hao Kuo, Chuei-Tang Wang
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
A novel wafer-scale system integration solution, InFO_SoW (System-on-Wafer), has been successfully developed to integrate known-good chips arrays with power and thermal module for high performance computing. InFO_SoW eliminates the use of substrate a
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
An advanced 3D Multi-stack (MUST) system integration technology, 3D MUST-in-MUST (3D-MiM) fan out package, has been developed as next generation wafer-level fan-out package technology. 3D-MiM technology utilizes a more simplified architecture which e
Publikováno v:
Journal of the Chinese Institute of Engineers. 30:481-490
As is well known, the design parameters of the packaging material and structure greatly influence the reliability of the packaging. When it comes to flip chip packages, the package reliability design becomes more complicated. In addition, the interac
Autor:
Shang-Hong Lai, Terry Ku, Chiu-Hui Chen, Chun-Yu Lin, Chun-Jen Chen, Win-How Lee, Yueh-Ching Chung
Publikováno v:
SPIE Proceedings.
In this paper, we present a printed circuit board (PCB) inspection system based on using Hausdorff distance for image alignment and defect detection. In addition, we apply support vector machine (SVM) for the defect classification and the metal class
Publikováno v:
SPIE Proceedings.
In this paper, we propose a coarse-to-fine image comparison algorithm based on Hausdorff distance for PCB inspection. The Hausdorff distance can be used in a geometrics-based inspection framework for comparing binary edge maps extracted from the insp