Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Teresa Partida Manzanera"'
Autor:
Haotian Wang, Guang-Ming Zhang, Hongwei Ma, Xuhui Zhang, Teresa Partida Manzanera, Derek Braden, David Mark Harvey, M.A.A. Mohd Salleh
Publikováno v:
NDT & E International. :102856
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::86865097e4a5a40820b450c500eef039
https://doi.org/10.1016/j.ndteint.2023.102856
https://doi.org/10.1016/j.ndteint.2023.102856
Autor:
Partha Pratim Das, Paul R. Chalker, Vinod R. Dhanak, Richard J. Potter, Teresa Partida Manzanera, Sung-Jin Cho, Rajat Mahapatra, Iain G. Thayne, James T. Gibbon, Leanne A. H. Jones, Ivona Z. Mitrovic, J.W. Roberts
Publikováno v:
ECS Transactions
GaN high electron mobility transistors (HEMTs) have been commercially available for over 10 years, however gate leakage limits their performance. The HEMT has the advantages of offering simple associated circuit design and fail-safe operation. Curren
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a0eaa76356046dc6185dd1a5bda881b1
https://doi.org/10.1149/09701.0067ecst
https://doi.org/10.1149/09701.0067ecst
Autor:
Partha Pratim Das, Vinod R. Dhanak, Leanne A. H. Jones, J.W. Roberts, Richard J. Potter, Rajat Mahapatra, Teresa Partida-Manzanera, James T. Gibbon, Paul R. Chalker, Sung-Jin Cho, Iain G. Thayne, Ivona Z. Mitrovic
Publikováno v:
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY
A comprehensive study of the band alignments of TixAl1−xOy (with x = 9%, 16%, 25%, 36%, 100%) and GaxAl1−xOy (x = 5%, 20%, 80% and 95%) fabricated using atomic layer deposition on GaN has been presented using X-ray photoelectron spectroscopy and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3c28c5fd07a5d341a6c8a74d480215c0
https://eprints.gla.ac.uk/221312/1/221312.pdf
https://eprints.gla.ac.uk/221312/1/221312.pdf
Autor:
Kangkana Baishya, David M. Harvey, Teresa Partida Manzanera, Guangming Zhang, Derek R. Braden
Publikováno v:
Nondestructive testing and evaluation
A method for non-destructively tracking the integrity of flip chip solder joints through life is investigated in this paper. An industry standard double-sided PCB was designed and manufactured with 14 flip chips to assess the failure patterns of each
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::fa7a19621c71b067ee5bbc27150fa964