Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Terence Gan"'
Publikováno v:
Sensors and Actuators A: Physical. :468-475
A thermally actuated free space single crystal silicon micromirror device has been developed using one wafer low cost fabrication process. The device consists of a central mirror plate symmetrically joined with four thermal bimorph actuators through
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0c54c1bfe7924f3863cb6b61340bfe13
https://doi.org/10.1016/j.sna.2005.02.037
https://doi.org/10.1016/j.sna.2005.02.037
Publikováno v:
International Journal of Computational Engineering Science. :311-314
Thin silicon diaphragms are often used to realize various MEMS components such as beams, hinges, springs, and actuators. Such structures required different silicon film thickness to meet the given objectives. This paper presents a process technique f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e01ae8f411dc27a2318820f45469aa1c
https://doi.org/10.1142/s1465876303001150
https://doi.org/10.1142/s1465876303001150
Autor:
Benjamin A. Bonner, Terence Gan, Thomas H. Osterheld, Peter McKeever, Brian Lee, Duane S. Boning, Jeffrey Drue David
Publikováno v:
MRS Proceedings. 613
A new set of wafer-scale patterns has been designed for analysis and modeling of key CMP effects. In particular, the goal of this work is to develop methods to characterize the planarization capability of a CMP process using simple measurements on wa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::444afbebc979686c3812b0be90d6fc54
https://doi.org/10.1557/proc-613-d11.8.1/e8.8.1
https://doi.org/10.1557/proc-613-d11.8.1/e8.8.1
Publikováno v:
Journal of The Electrochemical Society. 148:G159
In this paper, we introduce a mathematical model for chemical mechanical polishing ~CMP! of reverse tone etchback shallow trench isolation ~STI! structures. We present a detailed formulation of the model and describe CMP experiments using a newly des
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d07fe5abf5284943196a19aaaf6e84f6
https://doi.org/10.1149/1.1348266
https://doi.org/10.1149/1.1348266
Conference
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