Zobrazeno 1 - 1
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pro vyhledávání: '"Teppei Kojio"'
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
In this research, a combination of thermo-sonic bonding (TSB) process and non-conductive film (NCF) material was used to fabricate vertically stacked through silicon via (TSV) assemblies. TSB is particularly attractive TSV assembly process because it
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::747b31c2b1cd01c60f4c866e9a9c7dfd
https://doi.org/10.1109/ectc.2018.00307
https://doi.org/10.1109/ectc.2018.00307
