Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Teo, Angela"'
Autor:
Chen, C.Q., Ang, G.B., Ng, P.T., Rivai, Francis, Ng, H.P., Quah, A.C.T., Teo, Angela, Lam, Jeffery, Mai, Z.H.
Publikováno v:
In Microelectronics Reliability September 2017 76-77:261-266
Autor:
Alfred Quah, Teo Angela, Zhihong Mai, Tam Yong Seng, Ang Ghim Boon, C. Q. Chen, Ng Hui Peng, Jeffrey Lam, Yip Kim Hong
Publikováno v:
International Symposium for Testing and Failure Analysis.
With the rapid development of semiconductor manufacturing technologies, IC devices evolve to smaller feature sizes and higher densities, and thus the task of performing successful failure analysis (FA) is becoming increasingly difficult. Device minia
Autor:
Ang, Ghim Boon, Chen Changqing, Zhao Si Ping, Neo Soh Ping, Yip Kim Hong, Loh Sock Khim, Ng Hui Peng, Teo, Angela, Ng Peng Tiong
Publikováno v:
Proceedings of the 20th IEEE International Symposium on the Physical & Failure Analysis of Integrated Circuits (IPFA); 2013, p177-181, 5p
Autor:
Yip, Vivien C.H., Wong, Hon Tym, Yong, Vernon K.Y., Lim, Boon Ang, Hee, Owen K., Cheng, Jun, Fu, Huazhu, Lim, Chingwei, Tay, Elton L.T., Loo-Valdez, Roselyn G., Teo, Hwei Yee, Lim PH, Angela, Yip, Leonard W.L.
Publikováno v:
Journal of Glaucoma; Jan2019, Vol. 28 Issue 1, p80-87, 8p
Publikováno v:
Bird Conservation International; Mar2018, Vol. 28 Issue 1, p133-144, 12p
Autor:
Chen, C. Q., Ng, G. B. Ang. P.T., Ng, H. P., Alfred, Q., Huang, Y. M., Mai, Z. H., Lam, Jeffery
Publikováno v:
2015 IEEE 22nd International Symposium on the Physical & Failure Analysis of Integrated Circuits; 2015, p242-245, 4p
Autor:
Cowan, Brett, Young, Alistair, Anderson, Craig, Doughty, Robert, Krittayaphong, Rungroj, Lonn, Eva, Marwick, Thomas, Reid, Chris, Sanderson, John, Schmieder, Roland, Teo, Koon, Wadham, Angela, Worthley, Stephen, Yu, Cheuk-Man, Yusuf, Salim, Jennings, Garry
Publikováno v:
Clinical Research in Cardiology; Jul2009, Vol. 98 Issue 7, p421-433, 13p
Autor:
Yip, Vivien C.H., Wong, Hon Tym, Yong, Vernon K.Y., Lim, Boon-Ang, Hee, Owen K., Cheng, Jun, Fu, Huazhu, Lim, Ching-Wei, Tay, Elton L.T., Loo-Valdez, Roselyn G., Teo, Hwei-Yee, Lim, Angela P.H., Yip, Leonard W.L.
Publikováno v:
Journal of Glaucoma; Jul2019, Vol. 28 Issue 7, pe132-e133, 2p
The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.
This title features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect