Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Teny Shih"'
Publikováno v:
IMAPSource Proceedings. 2022
As the industry moves forward the age of more than Moore, the next generation of packaging moves forward high density of chiplet or die splitting package integration. Especially for high performance computing applications, the advance packaging is to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e6bb433525e7f926dbf9849ae0cfdb42
https://doi.org/10.4071/001c.74633
https://doi.org/10.4071/001c.74633
Publikováno v:
2023 International Conference on Electronics Packaging (ICEP).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eaaa7c6ccee0d158d58c5cea07387d24
https://doi.org/10.23919/icep58572.2023.10129706
https://doi.org/10.23919/icep58572.2023.10129706
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4fd40f6d9118486dd23e254499af679d
https://doi.org/10.1109/eptc56328.2022.10013122
https://doi.org/10.1109/eptc56328.2022.10013122
Publikováno v:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2ec77bb5b1c76da71697a5a7a624f40a
https://doi.org/10.1109/eptc53413.2021.9663964
https://doi.org/10.1109/eptc53413.2021.9663964
Publikováno v:
ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
In the present generation, internet with instant data access brings up the demands of high speed Ethernet. Development of 400G Ethernet is currently underway. There are two common coding schemes: non-return-to-zero (NRZ) and pulse-amplitude modulatio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4553f770b26b761685283e2114dff3dd
https://doi.org/10.1115/ipack2021-66660
https://doi.org/10.1115/ipack2021-66660
Autor:
Yu Po Wang, Andrew Kang, Ying Wei Lu, Don Son Jiang, Pai Yu Cheng, Teny Shih, Po Yuan Su, David Lai
Publikováno v:
ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
From the fifth-generation (5G) of system architecture evolution, there are more and more demands which require high data rate communication, low latency, and massive connectivity for network data transmission. For millimeter-wave (mm-wave), communica
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e640078e9853823efba88cd9f8515a05
https://doi.org/10.1115/ipack2020-2507
https://doi.org/10.1115/ipack2020-2507
Autor:
C. Key Chung, P.J. Su, Teny Shih, Chun-Tang Lin, Nistec Chang, Yu-Po Wang, Joseph Hung, Nicholas Kao
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
During last couple years, the market of IC packag successful to implement Cu pillar Bump as a mainstream of high density flip chip packaging solution in each of product application market. High performance computing product requires advanced Si node,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7005ef254dd5378056e2517207bb051d
https://doi.org/10.1109/ectc32862.2020.00295
https://doi.org/10.1109/ectc32862.2020.00295
Autor:
Shih Ching Chen, Chung Chih Yen, Teny Shih, Cheng Hao Ciou, Ching Yu Huang, Wei Jen Chang, Chen Kuang Hsin, Ching-Wen Chiang, Hsien Wen Chen, Kang Wei Peng
Publikováno v:
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
Through silicon via (TSV) is one of the key technologies in 2.5D and 3D electronic package. When the different materials and processes are used in TSV structure, the warpage, via depth variation and silicon TTV are challenges on backside via reveal p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::120f436c4b1889c07010d8966fffe72e
https://doi.org/10.1109/ectc.2015.7159846
https://doi.org/10.1109/ectc.2015.7159846