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pro vyhledávání: '"Teng-Yin Lin"'
Autor:
Zhigang Song, Tarl Gordon, Teng-Yin Lin, Kan Zhang, Neerja Bawaskar, Steve Crown, Yandong Liu, Martin O'tool, Kannan Sekar, Toni Laaksonen, Daniel Greenslit, Mark Lagus, Ishtiaq Ahsan, Bill Evans, Joerg Winkler, Shahrukh Khan, DK Sohn, Frank Barth, John Masnik
Publikováno v:
2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
Functional logic test structures with ATPG blocks and scan chains have been the traditional inline logic learning vehicle for technology learning and development. However, these test structures often need processing of wafers up to a higher BEOL proc
Autor:
Shafaat Ahmed, Ketan Shah, Craig Child, Stephan Grunow, Dinesh Koli, Anbu Selvam Km Mahalingam, Adam da Silva, Tien-Jen Cheng, Mukta Sharma, Teng-Yin Lin
Publikováno v:
2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
Electroplating for the sub-50 nm pitch back-end-of-line (BEOL) interconnect metallization has become increasingly challenging mostly because of marginal seed coverage, inadequate plating process and/or chemistry, the limitation of scaling the barrier