Zobrazeno 1 - 10
of 30
pro vyhledávání: '"Teng Yu Wang"'
Publikováno v:
Journal of the Society for Information Display. 28:965-978
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b97c294f95e64205fb38c6bc0ff9101a
https://doi.org/10.1002/jsid.953
https://doi.org/10.1002/jsid.953
Autor:
Teng Yu Wang, Peichen Yu, Chien Hsun Chen, J. Andrew Yeh, Chun Ming Yeh, Chun Heng Chen, Chen-Hsun Du, Jui Chung Hsiao
Publikováno v:
ECS Journal of Solid State Science and Technology. 4:P319-P323
A 43-μm-thick Si(111) substrate was obtained using the stress-induced lift-off method with a screen-printed metal paste layer as the stress-generation layer. The reflection of the metal-removed side of the Si(111) substrate was lower than that of th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a8527e01e78ff569988eed8d42d4fe9e
https://doi.org/10.1149/2.0171508jss
https://doi.org/10.1149/2.0171508jss
Publikováno v:
2017 IEEE 44th Photovoltaic Specialist Conference (PVSC).
Epi and lift-off process can create single crystalline silicon wafers without kerf-loss. There are three steps in epi and lift-off process: porous layer formation, epitaxial growth, and exfoliation. The porous layer is created by electrochemical etch
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ac3d52d4d0c6427d53489291cc29d02a
https://doi.org/10.1109/pvsc.2017.8366079
https://doi.org/10.1109/pvsc.2017.8366079
Publikováno v:
Thin Solid Films. 557:372-375
A 3 μm thick silicon layers with nano-scale honeycomb structure on the surface were fabricated using the mask-less process, “Thermal-stress Induced Pattern Transfer method”. The thin silicon layer was deposited on a patterned sapphire substrate
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::165cea5a06359d531c7555afbae8408e
https://doi.org/10.1016/j.tsf.2013.10.019
https://doi.org/10.1016/j.tsf.2013.10.019
Autor:
Teng Yu Wang, You Guo Xu, Zhao Hui Huang, Ming Hao Fang, Yan Gai Liu, Xiao Wen Wu, Li Yin, Bao Lin Liu, Xiao Zhi Hu
Publikováno v:
Key Engineering Materials. :238-241
This paper mainly discusses the influences of heating temperatures and CeO2additive contents on the phase transformations of zirconia from zircon ore by carbothermal reduction. The phase transformations of zirconia from zircon ore by carbothermal red
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::de64a23bfd24360d4ab545fcbf0b155d
https://doi.org/10.4028/www.scientific.net/kem.602-603.238
https://doi.org/10.4028/www.scientific.net/kem.602-603.238
Publikováno v:
2016 IEEE 43rd Photovoltaic Specialists Conference (PVSC).
Silicon wafers sliced with diamond wire saw and SiC slurry are compared in this study. Diamond wire saw have high slicing speed and the cost is lower than slurry cut process. However it is not suitable for multi-crystalline wafer slicing process. In
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a998bc424b10a37e6a1ddbce51c07e4f
https://doi.org/10.1109/pvsc.2016.7749699
https://doi.org/10.1109/pvsc.2016.7749699
Autor:
Teng-Yu Wang
Publikováno v:
Advances in Solar Photovoltaic Power Plants ISBN: 9783662505199
Although solar energy is a green energy, it can produce a significant amount of waste. Some types of solar cells use rare elements or precious metals as the component material. Therefore, the recycling of PV modules is necessary for environmental and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4c093570a167409f6b8734a678c6fc40
https://doi.org/10.1007/978-3-662-50521-2_11
https://doi.org/10.1007/978-3-662-50521-2_11
Publikováno v:
Powder Technology. 200:216-223
A feasibility study on recovering silicon powder from slurry containing silicon carbide abrasives, silicon kerfs, and iron fragments generated by slicing silicon ingots in the wire-saw process was conducted. The glycol solution and iron fragments in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2680c19a4c7e09dec1e9dc0d66478104
https://doi.org/10.1016/j.powtec.2010.02.028
https://doi.org/10.1016/j.powtec.2010.02.028
Publikováno v:
Progress in Photovoltaics: Research and Applications. 17:155-163
The constantly rising price of silicon feedstock has been the most important factor preventing photovoltaic (PV) energy from reaching grid parity. On the other hand, large amount of silicon gets wasted during slicing. We report a promising approach t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8e055ef872669a852ebce17216a074e2
https://doi.org/10.1002/pip.863
https://doi.org/10.1002/pip.863
Fabrication of 40 µm thin silicon solar cells with different crystal orientation by SLiM-cut process
Publikováno v:
2015 IEEE 42nd Photovoltaic Specialist Conference (PVSC).
Thin silicon foils with two different crystal orientation were fabricated by SLiM-cut method. The thickness of the and foils are 45 µm and 33 µm, respectively. The surface quality was compared in this study. The foil have smoother surface than the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7acaa88916f47b7a85a558ecc959051b
https://doi.org/10.1109/pvsc.2015.7355742
https://doi.org/10.1109/pvsc.2015.7355742