Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Tekeshi Hatta"'
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2013:000751-000777
Flip chip connection has been applied to a lot of applications in order to shorten the connection length of high performance devices. Solder bumping is one of the key technologies for flip chip connections, and its quality makes a large impact on the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3912e1777dda9cbbb47bd8c21f3997bb
https://doi.org/10.4071/2013dpc-tp21
https://doi.org/10.4071/2013dpc-tp21
Autor:
Haiyan Gong, Xuenan Xuan, Min Liao, Jinlin Zhou, Hirotaka Kanuka, Kozo Fujisaki, Penglong Huang, Tekeshi Hatta, Guohong Zhang, Yoshifumi Nishikawa
Publikováno v:
Veterinary Parasitology. 151:268-278
Ribosomal protein P0 has been demonstrated to be a multifunctional protein in the large subunit of eukaryotic ribosome. In this study, a gene encoding ribosomal protein P0 termed HlP0 was isolated from a full-length salivary gland cDNA library previo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::471a2adbff3781107c8cf973c60abaa8
https://doi.org/10.1016/j.vetpar.2007.11.015
https://doi.org/10.1016/j.vetpar.2007.11.015