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Morphology Behavior of Copper Films Deposited after Wet Surface Treatment on Polished Alumina

Autor: Flacker,Alexander, Gomes,Gabriela C., Silva,Michele O., Teixeira,Ricardo C.

Publikováno v: Journal of the Brazilian Chemical Society, Volume: 33, Issue: 6, Pages: 600-607, Published: 30 MAY 2022
Journal of the Brazilian Chemical Society v.33 n.6 2022
Journal of the Brazilian Chemical Society
Sociedade Brasileira de Química (SBQ)
instacron:SBQ

In this paper, a pre-treatment process for electroless copper (Cu) deposition on the polished alumina (Al2O3) 99.9% and the behavior of Cu plating by electroless process after Al2O3 surface treatment were explored. Our work was carried out by changin

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::6ccf221da6875bc452ddcfbaf8387a2e
http://www.scielo.br/scielo.php?script=sci_arttext&pid=S0103-50532022000600600&lng=en&tlng=en

A Survey on Microtransformers.

Autor: do Nascimento, Fellype, Telles, Antonio C. C., Joanni, Ednan, Teixeira, Ricardo C.

Publikováno v: Journal of Integrated Circuits & Systems; 2021, Vol. 16 Issue 2, p1-12, 12p

Development of MCM-D technology with photosensitive benzocyclobutene.

Autor: Adamo, Cristina B., Flacker, Alexander, Cavalcanti, Hercilio M., Teixeira, Ricardo C., Rotondaro, Antonio L. P., Manera, Leandro T.

Publikováno v: 2015 IEEE International Symposium on Intelligent Control (ISIC); 2015, p1-4, 4p