Zobrazeno 1 - 10
of 92
pro vyhledávání: '"Tei Chen Chen"'
Autor:
Fu-Chieh Hsu, Tei-Chen Chen
Publikováno v:
AIMS Materials Science, Vol 6, Iss 3, Pp 377-396 (2019)
This article investigates the nanoscale mechanical properties and deformation mechanism of Nix–Al100−x metallic glasses nanowires (NWs) subjected to uniaxial compressive stress. Molecular dynamics (MD) simulation is carried out using the program
Externí odkaz:
https://doaj.org/article/310eab104de8410cb24dcb6e516cbed3
Autor:
Po-Hsien Sung, Tei-Chen Chen
Publikováno v:
Crystals, Vol 10, Iss 6, p 540 (2020)
Due to the rapid increase in current density encountered in new chips, the phenomena of thermomigration and electromigration in the solder bump become a serious reliability issue. Currently, Ni or TiN, as a barrier layer, is widely academically studi
Externí odkaz:
https://doaj.org/article/8596fbe106c644aa952ed9182b2f3499
Autor:
Yen-Hung Lin, Tei-Chen Chen
Publikováno v:
Crystals, Vol 9, Iss 5, p 240 (2019)
Molecular dynamics (MD) simulation was employed to examine the deformation and phase transformation of mono-crystalline Si nanowire (SiNW) subjected to tensile stress. The techniques of coordination number (CN) and centro-symmetry parameter (CSP) wer
Externí odkaz:
https://doaj.org/article/a8921cc7bc424ab9949de4febf88a7c9
Autor:
Tei Chen Chen, Fu Chieh Hsu
Publikováno v:
AIMS Materials Science. 6:377-396
This article investigates the nanoscale mechanical properties and deformation mechanism of Nix–Al100−x metallic glasses nanowires (NWs) subjected to uniaxial compressive stress. Molecular dynamics (MD) simulation is carried out using the program
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9c031f8612518a51d68a7ba3da19fbb9
https://doi.org/10.3934/matersci.2019.3.377
https://doi.org/10.3934/matersci.2019.3.377
Autor:
Po Hsien Sung, Tei Chen Chen
Publikováno v:
Coatings, Vol 10, Iss 1087, p 1087 (2020)
Coatings
Volume 10
Issue 11
Coatings
Volume 10
Issue 11
It is well-known that Cu&ndash
Sn intermetallic compounds are easily produced during reflow process and result in poor reliability of solder bump. Recently, amorphous metallic films have been considered to be the most effective barrier layer bec
Sn intermetallic compounds are easily produced during reflow process and result in poor reliability of solder bump. Recently, amorphous metallic films have been considered to be the most effective barrier layer bec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a074f295440e8f32f271cdf34dde90eb
https://www.mdpi.com/2079-6412/10/11/1087
https://www.mdpi.com/2079-6412/10/11/1087
Autor:
Chin Li Kao, Tei Chen Chen
Publikováno v:
Transactions of the Canadian Society for Mechanical Engineering. 42:268-279
The thermal performance of a powered wirebond device with package level and board level test specimens was investigated by both analytical and experiment methods. The effects of thickness and thermal conductivity of the molding compound and heat spre
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9cd835f11e1a656e74253f4ce7fd54e9
https://doi.org/10.1139/tcsme-2017-0013
https://doi.org/10.1139/tcsme-2017-0013
Autor:
Tei Chen Chen, Chin Li Kao
Publikováno v:
Microelectronics Reliability. 82:204-212
The purpose of this paper is to measure and analyze the Sn-1Ag-0.5Cu solder joints under high speed ball impact test (BIT) conditions. In this study, the ball impact test was conducted at impact velocity of 300 mm/s on package-level solder joints wit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e0ee494e44dcd6ed01cda36a55a5d56d
https://doi.org/10.1016/j.microrel.2018.02.001
https://doi.org/10.1016/j.microrel.2018.02.001
Publikováno v:
Mathematics and Mechanics of Solids. 23:879-895
The interconversion relations for viscoelastic functions are derived with the consideration of the time-dependent bulk modulus, K( t), for both traditional and fractional Prony series representations of viscoelasticity. The application of these relat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a4f8e799f24d4e4de3d3ff5687ed81fe
https://doi.org/10.1177/1081286517694935
https://doi.org/10.1177/1081286517694935
Autor:
Tei Chen Chen, Chin Lung Lin
Publikováno v:
Transactions of the Canadian Society for Mechanical Engineering. 41:159-168
A simple geometric model is proposed for estimating the azimuthal anchoring energy between the sinusoidal relief grating surface and nematic liquid crystal layer of a liquid crystal display (LCD) device as a function of the grating height and grating
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::553df37a2a7281668c8dc8a27d3fa2f5
https://doi.org/10.1139/tcsme-2017-1011
https://doi.org/10.1139/tcsme-2017-1011
Publikováno v:
International Journal of Solids and Structures. 96:136-144
We have investigated the possible oscillation of linear and non-aging viscoelastic functions of viscoelastic models whose governing differential equations representing the constitutive relation between stresses and strains are of second order. We hav
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7294472203ae06ba8a7b2f38ccc1f8e3
https://doi.org/10.1016/j.ijsolstr.2016.06.015
https://doi.org/10.1016/j.ijsolstr.2016.06.015