Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Teemu Salo"'
Publikováno v:
Micromachines, Vol 13, Iss 10, p 1732 (2022)
The addition of fillers has been implemented in fused filament fabrication (FFF), and robust carbon fillers have been found to improve the mechanical, electrical, and thermal properties of 3D-printed matrices. However, in stretchable matrices, the us
Externí odkaz:
https://doaj.org/article/47f82738597b471a88c54a18c996c248
Autor:
Teemu Salo, Lukas Werft, Basel Adams, Donato Di Vito, Aki Halme, Vitalij Scenev, Hans Walter, Thomas Loeher, Jukka Vanhala
Publikováno v:
Flexible and Printed Electronics.
Stretchable electronics can be realized using different manufacturing methods and hybrids thereof. An example of the latter is the combination of stretchable circuit boards with screen-printing, which will be discussed in this work. The hybrid stretc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::085d6b28781fc63b8759e04cfbb8989c
https://doi.org/10.1088/2058-8585/acda46
https://doi.org/10.1088/2058-8585/acda46
Stretchable electronics pose a great challenge for electrical designers since mechanical interaction between the parts of these platforms should be properly taken into account and cannot be neglected. This work represents an effort to highlight some
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a25ed73a6d000b46cd6104389d6e3c34
https://trepo.tuni.fi/handle/10024/143219
https://trepo.tuni.fi/handle/10024/143219
Publikováno v:
2006 Proceedings of the 32nd European Solid-State Circuits Conference.
An ASIC is implemented for readout and control of a bulk micromachined capacitive gyroscope. Both the system architecture and details on the circuitry of different subsystems are presented. Together with digital signal processing on an FPGA chip, a c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0578a12df89a6801ea5f935f5851dd4f
https://doi.org/10.1109/esscir.2006.307576
https://doi.org/10.1109/esscir.2006.307576
Publikováno v:
2006 Proceedings of the 32nd European Solid-State Circuits Conference; 2006, p243-246, 4p