Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Ted Tessier"'
Autor:
Ted Tessier
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2016:000397-000420
WLCSP has been widely deployed in portable computing and communication devices for efficient die level packaging of integrated semiconductor and integrated passive applications. More recently with the proliferation of smart phone capabilities and app
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2ac24f25177b91f7506caa734c2cb1e1
https://doi.org/10.4071/2016dpc-ta23
https://doi.org/10.4071/2016dpc-ta23
Autor:
Gordy Grivna, Guy F. Burgess, David Lishan, Linnell Martinez, Thierry Lazerand, David Pays-Volard, Ted Tessier, Kenneth Mackenzie, Jason Doub
Publikováno v:
International Symposium on Microelectronics. 2014:000148-000154
To meet the changing demands of consumer product form factors, there has been a steady shift to thinner and smaller semiconductor die, both of which increase the challenges for die singulation. The traditional approach of saw dicing is facing new lim
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4febf628db9bf12d6327efa66b0794a9
https://doi.org/10.4071/isom-ta56
https://doi.org/10.4071/isom-ta56
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2013:000471-000494
Overview: Fan-In WLP plays crucial role on today's high density, high performance IC Packaging. 300 mm wafer processing addresses cost-per-unit reduction and volume demand. Results of Spheron Fan-In WLCSP Technology Qualification and 200 mm to 300 mm
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1f5e2ee2016a9b86e3b2cabd2ce46ba3
https://doi.org/10.4071/2013dpc-ta24
https://doi.org/10.4071/2013dpc-ta24
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2013:001894-001907
Wafer Level Chip Scale Packages (WLCSP) have seen wider adoption in hand held as well as automotive electronics in recent years due to their unmatched form factor reductions and improved electrical performance. WLCSP's have gained popularity in high
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f3a9cf5827a045511ebfb6ece0924dca
https://doi.org/10.4071/2013dpc-tha21
https://doi.org/10.4071/2013dpc-tha21
Autor:
Daniel F. Baldwin, Zhaozhi Li, Gene Stout, Ted Tessier, Brian J. Lewis, John L. Evans, Paul N. Houston, Sangil Lee
Publikováno v:
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
Flip chip process excels due to its low cost, fine pitch, small form factor and its ready-adaptation to the conventional Surface Mount Technology (SMT) process, in the fact that the reflow is often used to form the solder joint. As the use of Pb free
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::18cf29a9c117f9c409addf41b6276bb7
https://doi.org/10.1109/ectc.2010.5490844
https://doi.org/10.1109/ectc.2010.5490844
Autor:
Ted Tessier
Publikováno v:
Emerging Technology in Advanced Packaging Series ISBN: 9780792376767
The 80’s was the MCM era, when we all thought that multi-chip modules (MCM) were going to be the next big package innovation. MCMs were going to be the next big package innovation. MCMs were going to revolutionize packaging across the board from hi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::18e165b652cb96f003dd5fc041c4c7df
https://doi.org/10.1007/978-1-4615-0231-9_9
https://doi.org/10.1007/978-1-4615-0231-9_9
Publikováno v:
Microelectronics Packaging Handbook ISBN: 9781461377672
Thin film refers to a coating layer of thickness typically in the range of from a few (2–3) atomic layers to a few (1–5) microns. However, film thicknesses up to 20–50 μm are frequently regarded as thin-film in electronic packaging. Thin-film
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::077feffc3aefadb77cc8f20ed800758e
https://doi.org/10.1007/978-1-4615-6037-1_6
https://doi.org/10.1007/978-1-4615-6037-1_6