Zobrazeno 1 - 10
of 21
pro vyhledávání: '"Teck Joo Goh"'
Publikováno v:
Microelectronics International. 23:3-10
PurposeThis paper's purpose is to review the design of a flip chip thermal test vehicle.Design/methodology/approachDesign requirements for different applications such as thermal characterization, assembly process optimization, and product burn‐in s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e84429c6d3b42add307a581d55db641f
https://doi.org/10.1108/13565360610669959
https://doi.org/10.1108/13565360610669959
Publikováno v:
Microelectronics International. 23:37-44
PurposeAims to present a finite element analysis based methodology for estimating the characteristic fatigue life of a solder joint interconnect under accelerated temperature cycling to predict the reliability performance of a flip chip package.Desig
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::87a83e9422c60702a1bad44a8d2140d8
https://doi.org/10.1108/13565360610659707
https://doi.org/10.1108/13565360610659707
Autor:
Kankanhalli N. Seetharamu, Kor Oon Lee, G.A. Quadir, Kang Eu Ong, Ishak Abdul Azid, Teck Joo Goh, Zainal Alimuddin Zainal
Publikováno v:
Microelectronics International. 22:10-15
PurposeTo find the optimal geometries of rectangular and cylindrical fins for maximum heat dissipation.Design/methodology/approachThe objective function for finding the optimized profiles of fins are solved by using the genetic algorithms (GAs). A ra
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::86d8218f6a9f593ae7eb8e4f8e00aa1c
https://doi.org/10.1108/13565360510575495
https://doi.org/10.1108/13565360510575495
Autor:
Teck Joo Goh
Publikováno v:
Journal of Electronic Packaging. 123:83-87
The silicon die of an organic flip chip assembly is exposed to external mechanical loads during component testing and heat sink attachment. These loads can potentially cause package to flexure and may eventually lead to severe damage in the die and p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::04b41d1a3f5785b4f6e323cbd6539cdf
https://doi.org/10.1115/1.1289999
https://doi.org/10.1115/1.1289999
Publikováno v:
ASME 4th International Conference on Nanochannels, Microchannels, and Minichannels, Parts A and B.
In this paper, a numerical simulation is carried to study pressure drop and heat transfer in a fractal tree-like microchannel net heat sink of 10mm×12.5mm×0.5mm in dimensions. The numerical result is obtained by solving three-dimensional Navier-Sto
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5d1ec8b35f3ff736ee9ce0b7174e4321
https://doi.org/10.1115/icnmm2006-96157
https://doi.org/10.1115/icnmm2006-96157
Publikováno v:
TENCON 2003. Conference on Convergent Technologies for Asia-Pacific Region.
The implementation of the finite element method (FEM) in thermal analysis usually produces a formulation in the space/time domain. This kind of space/time domain formulation leads to a set of ordinary differential equations which have to be solved in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::28d73381cd7e2ba759ff0f4382763981
https://doi.org/10.1109/tencon.2003.1273366
https://doi.org/10.1109/tencon.2003.1273366
Autor:
Teck Joo Goh
Publikováno v:
4th Electronics Packaging Technology Conference, 2002..
Non-uniform power consumption across different functional units is commonly found in the contemporary microprocessor architectures. In such integrated circuit (IC) design, certain regions of the chip can dissipate a significant fraction of the total
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a07d126b0911bccbfd0d47208040aee0
https://doi.org/10.1109/eptc.2002.1185689
https://doi.org/10.1109/eptc.2002.1185689
Publikováno v:
2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2.
This paper reviews the design of a flip chip thermal test vehicle. Design requirements for different applications such as thermal characterization, assembly process optimization, and product burn-in simulation are outlined. The design processes of di
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::626db1f1cdd8436b4a0a300ead9de0ca
https://doi.org/10.1115/ipack2003-35142
https://doi.org/10.1115/ipack2003-35142
Autor:
Teck Joo Goh
Publikováno v:
Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235).
Numerous studies have indicated that by encapsulating the solder joint with underfill material, the reliability of flip chip on board (FCOB) assemblies can be effectively enhanced. Typical manufacturing processes for FCOB assembly with underfill, how
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dd08ed9ec8414ab1b5a34560e081b385
https://doi.org/10.1109/eptc.1998.755979
https://doi.org/10.1109/eptc.1998.755979
Publikováno v:
2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
This paper presents a novel thermal metrology that is based on non-uniform power distribution. This metrology has successfully been used for validating the cartridge thermal design of Pentium(R) III Xeon/sup TM/ processor products with large integrat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b9916bb8ee02d258e40602ca1b767417
https://doi.org/10.1109/ectc.2001.927976
https://doi.org/10.1109/ectc.2001.927976