Zobrazeno 1 - 10
of 61
pro vyhledávání: '"Technologie des Couches Epaisses"'
Publikováno v:
Scopus-Elsevier
This article describes the design and fabrication of a hermetic LTCC package for an optical MEMS chip designed for space applications. The package must ensure electrical and optical connections, mechanical positioning, atmosphere control, and finally
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1e9f1cf496692339f87e8e4ca200380d
https://doi.org/10.4071/1551-4897-6.1.32
https://doi.org/10.4071/1551-4897-6.1.32
Publikováno v:
Journal of the European Ceramic Society. 26:1937-1941
The motivation of this study is the need for fundamental understanding of the effects of processing conditions on the electrical properties of low- temperature co-fired ceramic (LTCC) tapes, those screen printed with commercial thick-film pastes of e
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7a112ccb74ed6cba5bbccf2d5f8aa8e8
https://doi.org/10.1016/j.jeurceramsoc.2005.09.030
https://doi.org/10.1016/j.jeurceramsoc.2005.09.030
Publikováno v:
International Journal of Applied Ceramic Technology. 2:364-373
Ease of fabrication and design flexibility are two attractive features of low temperature co-fired ceramics (LTCC) technology for fabrication of complex micro-fluidic devices. Such structures are designed and processed using different shaping methods
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a2931535b44bb540a06e1c737a038e44
https://doi.org/10.1111/j.1744-7402.2005.02036.x
https://doi.org/10.1111/j.1744-7402.2005.02036.x
Publikováno v:
Journal of the European Ceramic Society. 25:2129-2132
A vast class of disordered conducting-insulating compounds close to the percolation threshold is characterized by nonuniversal values of transport critical exponents. The lack of universality implies that critical indexes may depend on material prope
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::bf1ac15f77ea3c430a4de7d854a38e91
https://doi.org/10.1016/j.jeurceramsoc.2005.03.018
https://doi.org/10.1016/j.jeurceramsoc.2005.03.018
Publikováno v:
Journal of the European Ceramic Society. 25:2065-2069
In spite of many advantages it offers for micro-electronic packaging, the low temperature co-fired ceramic (LTCC) technology has yet certain issues to be solved. Physical and chemical reactions, for instance, within and between the passive electronic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::03a1bb87be0683ea49fd0b1bba4b15d6
https://doi.org/10.1016/j.jeurceramsoc.2005.03.182
https://doi.org/10.1016/j.jeurceramsoc.2005.03.182
Publikováno v:
Chemical Engineering Journal. 101:241-250
A new system combining a microreactor and a microcalorimetric chip was investigated. The small size of the microreactor channel permits maintaining isothermal conditions necessary for the kinetic characterization of highly exothermic reactions. These
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::35be3a356513437aed671c14ffee336a
https://doi.org/10.1016/j.cej.2003.11.005
https://doi.org/10.1016/j.cej.2003.11.005
Publikováno v:
Journal of the European Ceramic Society. 24:1889-1892
In this work, we aim to understand the firing behaviour of three representative thick-film resistor compositions used in force and pressure sensors. The dependence of the materials' microstructure and properties (sheet resistance and its temperature
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8a70fdf22a2523a203863012b54918d0
https://doi.org/10.1016/s0955-2219(03)00462-x
https://doi.org/10.1016/s0955-2219(03)00462-x
Publikováno v:
Applied Physics Letters. 85:5619-5621
We show that in RuO2–glass composites the nonuniversal resistivity exponent can be modulated by an applied mechanical strain, signaled by a logarithmic divergence of the piezoresistive response at the percolation threshold. We interpret this phenom
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7846ef138feea359bc78de1009ad0d97
https://doi.org/10.1063/1.1835996
https://doi.org/10.1063/1.1835996
Autor:
Jacques Jacot, Frank Seigneur
Publikováno v:
IFIP International Federation for Information Processing ISBN: 0387312765
IPAS
IPAS
Packaging is the last process of microsystem manufacturing. There are mainly two kinds of packages: plastic or metallic. The two main components of the package (base and cover) may either be glued or soldered. Each of these techniques has its advanta
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::93fbd0f46528dda843829e1888a1fe47
https://doi.org/10.1007/0-387-31277-3_29
https://doi.org/10.1007/0-387-31277-3_29
Publikováno v:
IEEE Transactions on Biomedical Engineering, Vol. 52, No 9 (2005) pp. 1609-11
A force-sensing device to intraoperatively measure knee joint forces and moments to improve the ligament balancing procedure during total knee arthroplasty has been developed. It consists of two sensitive plates, one for each condyle, a tibial base p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5db8aa429bb4ba1ec3441c60e5a0bb01
https://archive-ouverte.unige.ch/unige:39729
https://archive-ouverte.unige.ch/unige:39729