Zobrazeno 1 - 10
of 185
pro vyhledávání: '"Tayfun AKIN"'
Autor:
Serhat Kocak, Tayfun Akin
Publikováno v:
Electronics Letters, Vol 60, Iss 9, Pp n/a-n/a (2024)
Abstract This paper presents an energy‐efficient digital‐to‐analog converter (DAC) switching method with low common‐mode variations for high‐resolution successive approximation register (SAR) analog‐to‐digital converters (ADCs), while e
Externí odkaz:
https://doaj.org/article/825e426697c644a1af61bb0afac911e2
Publikováno v:
Micromachines, Vol 15, Iss 8, p 935 (2024)
This paper introduces a cost-effective, high-performance approach to achieving wafer level vacuum packaging (WLVP) for MEMS-based uncooled infrared sensors. Reliable and hermetic packages for MEMS devices are achieved using a cap wafer that is formed
Externí odkaz:
https://doaj.org/article/f8d459bea3334d2e973e3431e630d499
Autor:
Serhat Kocak, Tayfun AKIN
This paper presents an energy-efficient digital-to-analog converter (DAC) switching method with low common-mode variations for high resolution successive approximation register (SAR) analog-to-digital converters (ADCs), while enabling to implement re
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6559a75735d576a55cf5ae0ebcfb6c56
https://doi.org/10.22541/au.168022804.43194023/v1
https://doi.org/10.22541/au.168022804.43194023/v1
Publikováno v:
IEEE Sensors Journal. 21:13958-13964
Thispaper introduces a novel, inherently simple, and all-silicon wafer-level fabrication and hermetic packaging method developed for MEMS devices. The proposed method uses two separate SOI wafers to form highly-doped through-silicon vias (TSVs) and s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9412335bcfb6f715592a13dd3b786fba
https://doi.org/10.1109/jsen.2021.3073928
https://doi.org/10.1109/jsen.2021.3073928
Autor:
Tayfun Kucukyilmaz, Tayfun Akin
In information retrieval, words that contribute little to the semantic information within a text are called stopwords. Identification of stopwords is considered an asset for many retrieval tasks as removal of such words from the text collection incre
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6fb4afd6350e47747e0b1bceb23d9e75
https://doi.org/10.21203/rs.3.rs-1986294/v1
https://doi.org/10.21203/rs.3.rs-1986294/v1
Publikováno v:
Journal of Microelectromechanical Systems. 30:64-71
A novel solid-liquid inter-diffusion (SLID) bonding process is developed allowing to use thin layers of the Au-Sn material in wafer-level microelectromechanical systems (MEMS) packaging while providing a good bonding strength. The bond material layer
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5140e65e896798471bcb4d399d139cf0
https://doi.org/10.1109/jmems.2020.3040039
https://doi.org/10.1109/jmems.2020.3040039
Autor:
Emrah Dirican, Bahar Atik, Mustafa Yıldırım, Hakan Altan, Tayfun Akin, Okan Esenturk, Oytun Demirörs
Publikováno v:
Terahertz Emitters, Receivers, and Applications XII.
The microbolometer technology has proved its potential in the Infrared (IR) region due to its low fabrication costs, and room temperature operation, making this technology desirable to be used in various applications, and this interest has recently e
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c182c1117b800f526c3c91cbe3383684
https://doi.org/10.1117/12.2594145
https://doi.org/10.1117/12.2594145
Autor:
Hakan Altan, Emrah Dirican, Okan Esenturk, Tayfun Akin, Oytun Demirörs, Bahar Atik, Mustafa Yıldırım
Publikováno v:
Terahertz Emitters, Receivers, and Applications XII.
Imaging in the Terahertz (THz) region has drawn attention in recent years, but the nature of the THz frequency regime causes some drawbacks in imaging such as long wavelength, high cost, and low emission levels at room temperature. Because of the hig
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::746dea1a9727e0b6ff01a93ef4ef5234
https://doi.org/10.1117/12.2594067
https://doi.org/10.1117/12.2594067
Publikováno v:
Journal of Microelectromechanical Systems. 28:724-731
This paper presents a novel wafer-level packaging method for shunt, capacitive RF MEMS switches using BCB as the adhesive interlayer. Fabrication and electrical characteristics of the proposed package were initially evaluated for 50 $\Omega $ CPW lin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7d5b3453808aef34b98fd9b19d42fd31
https://doi.org/10.1109/jmems.2019.2912745
https://doi.org/10.1109/jmems.2019.2912745
We have calculated interband optical absorption for InAs/GaSb based type-II superlattice (SL) structures. The empirical pseudopotential method (EPM) has been used as an alternative to the k.p method since it is less sophisticated while providing simi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a1a45b16131cbf64db69d0a5d9de1d82
https://aperta.ulakbim.gov.tr/record/238816
https://aperta.ulakbim.gov.tr/record/238816