Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Tay Tiong We"'
Nonlinear dynamic behavior of thin PCB board for solder joint reliability study under shock loading.
Publikováno v:
2005 International Symposium on Electronics Materials & Packaging; 2005, p268-274, 7p
Autor:
Wong Shaw Fong, Wong Siang Woen, Lee Yung Hsiang, Yap Eng Hooi, Loh Wei Keat, Martin Tay Tiong We, Hin Tze Yang
Publikováno v:
2005 International Symposium on Electronics Materials and Packaging.
This paper outlines and discusses the new mechanical characterization metrologies applied on PCI board envelope. 'The dynamic responses of PCI board were monitored and characterized using accelerometer and strain gauges. PCI board performances were a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::42b0882f3403184644478f554326d0f2
https://doi.org/10.1109/emap.2005.1598243
https://doi.org/10.1109/emap.2005.1598243
Publikováno v:
2005 International Symposium on Electronics Materials and Packaging.
Solder joint reliability under shock loading condition has been a concern over the years especially with constant reductions in the characteristic dimensions of the package and the solder joint. With the impeding transition to lead free solder, atten
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3603a3f799793d527e1316caa0f82e29
https://doi.org/10.1109/emap.2005.1598274
https://doi.org/10.1109/emap.2005.1598274
Publikováno v:
2006 8th Electronics Packaging Technology Conference; 2006, p800-805, 6p
Autor:
Wong Shaw Fong, Loh Wei Keat, Lee Yung Hsiang, Yap Eng Hooi, Wong Siang Woen, Hin Tze Yang, Martin Tay Tiong We
Publikováno v:
2005 International Symposium on Electronics Materials & Packaging; 2005, p101-106, 6p
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.
Publikováno v:
2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium; 2006, p185-190, 6p
Publikováno v:
2005 International Symposium on Electronics Materials & Packaging; 2005, piii-vi, 4p
Autor:
Yeoh Eng Hong, We, M.T.T.
Publikováno v:
Proceedings International Test Conference 1997; 1997, p304-309, 6p
Publikováno v:
Proceedings 1998 IEEE International Symposium on Defect & Fault Tolerance in VLSI Systems (Cat No98EX223); 1998, p93-101, 9p