Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Tatsushi Sato"'
Autor:
Xiaoyou ZHANG, Tadahiko SHINSHI, Akira SHIMOKOHBE, Tatsushi SATO, Hidetaka MIYAKE, Takayuki NAKAGAWA
Publikováno v:
Journal of Advanced Mechanical Design, Systems, and Manufacturing, Vol 2, Iss 4, Pp 493-503 (2008)
The objective of this study is to realize high-speed electrical discharge machining (EDM) using a wide-bandwidth, high-precision, millimeter-stroke, 5-DOF controlled maglev local actuator. In this paper, we report on the EDM of 1mm diameter holes usi
Externí odkaz:
https://doaj.org/article/311301157b5e42f8a3e000797f41e3bc
Autor:
Takeharu Kuroiwa, Tatsushi Sato, Yoshiyuki Nakaki, Hiroaki Sumitani, Hidetaka Miyake, Tomoaki Furusho, Satoshi Yamakawa, Yoshihiko Toyoda, Atsushi Itokazu, Nobuyuki Tomita, Takashi Hashimoto
Publikováno v:
Materials Science Forum. :784-787
The multi-wire electrical discharge slicing (multi-wire EDS), which is a brand-new method for fabricating wafers, is expected to considerably reduce the production cost of SiC wafers by decreasing in the width of kerf and kerf loss. We evaluated, for
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3634811830d2886904ac84f1a722d077
https://doi.org/10.4028/www.scientific.net/msf.778-780.784
https://doi.org/10.4028/www.scientific.net/msf.778-780.784
Publikováno v:
Journal of The Japan Society of Electrical Machining Engineers. 48:118-127
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1810573f3d104dea6e05ebf878c646f7
https://doi.org/10.2526/jseme.48.118
https://doi.org/10.2526/jseme.48.118
Autor:
Tatsushi SATO
Publikováno v:
Journal of the Japan Society for Precision Engineering. 71:549-552
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e6d5733ded648ee8e50901b5e5627a36
https://doi.org/10.2493/jjspe.71.549
https://doi.org/10.2493/jjspe.71.549
Autor:
Tatsushi Sato, Junichi Shibata
Publikováno v:
Journal of Materials Processing Technology. 149:129-133
A tiny hollow space on the interface between the approach and the machining path may cause critical damage during superfine machining by wire-cut electrical discharge machine (WEDM). This paper points out that this space is caused by the reduction of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::903418fbbfd773092fd5064a6c9c9b76
https://doi.org/10.1016/j.jmatprotec.2003.11.041
https://doi.org/10.1016/j.jmatprotec.2003.11.041
Autor:
Tatsushi Sato, Jun-ichi Shibata
Publikováno v:
Journal of The Japan Society of Electrical Machining Engineers. 38:16-23
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f02b80f869ba4900227e840d652896f4
https://doi.org/10.2526/jseme.38.16
https://doi.org/10.2526/jseme.38.16
Autor:
Yoshihito Imai, Akihiro Goto, Kazuki Watanabe, Tatsushi Sato, Takuji Magara, Akinobu Takeuchi
Publikováno v:
Journal of The Japan Society of Electrical Machining Engineers. 31:1-13
EDM contouring is more advantageous in electrode cost and machining flexbility than the conventional diesinking EDM. Though the contouring had been thought to be less accurate due to the electrode wear, it was found that the contouring could achieve
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::33f065e5b1fac33a79ea39a08c88c7d7
https://doi.org/10.2526/jseme.31.67_1
https://doi.org/10.2526/jseme.31.67_1
Publikováno v:
Journal of The Japan Society of Electrical Machining Engineers. 29:27-39
In die-sinking EDM, sensing a state of machining is important for both preventing surface damage and improving material removal rate. This paper describes how to sense a state of machining using voltage waveform between a tool electrode and a workpie
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::67e7fc1bed0d840e2d2aec0207bc86aa
https://doi.org/10.2526/jseme.29.62_27
https://doi.org/10.2526/jseme.29.62_27
Publikováno v:
Materials Science Forum. :841-842
In this paper, we propose a new wafer slicing method for silicon carbide(SiC). SiC is well-known as a difficult-to-cut material, and a conventional slicing via multi-wire saw becomes more difficult with increasing ingot size. To solve this problem, t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c14326f2f67d99a768a89ae98e3d71f9
https://doi.org/10.4028/www.scientific.net/msf.740-742.841
https://doi.org/10.4028/www.scientific.net/msf.740-742.841
Autor:
Masayoshi Tarutani, Tatsushi Sato, Y. Yoneda, Tsuyoshi Horikawa, Takashi Takenaga, Takaaki Kawahara, Teruo Shibano, Mikio Yamamuka, Takeharu Kuroiwa, Shigeru Matsuno
Publikováno v:
MRS Proceedings. 655
(Ba,Sr)TiO3 [BST] films were deposited by the flash vaporization CVD method with a unique liquid delivery system. An inductively coupled plasma mass spectrometry [ICP-MS] analysis revealed the decline of (Ba+Sr)/Ti molar ratio of the initial BST-laye
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::73b8566e3867a54edcc847e0c3f30ceb
https://doi.org/10.1557/proc-655-cc6.5.1
https://doi.org/10.1557/proc-655-cc6.5.1