Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Tatsuo Nagamatsu"'
Autor:
Hiromi Shibahara, Maeda Toru, Tatsuo Nagamatsu, Hidekazu Yagi, Daisuke Tani, Ryoji Kojima, Junichi Kaneko, Tetsuya Utano, Doug Day, Watanabe Osamu, Sung Chenhsiu, Nakamura Tomonori, Mori Daichi
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
We demonstrate a dynamic characteristics evaluation system using a flip chip bonder for non-conductive film (NCF) and its applications for analysis and design of the processes. Under thermally transient conditions, quasi-static viscosity of NCF which
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ca271873aede1527cc9b5ed4405fe9cc
https://doi.org/10.1109/ectc.2019.00297
https://doi.org/10.1109/ectc.2019.00297
Autor:
Nakamura Tomonori, Mori Daichi, Watanabe Osamu, Tatsuo Nagamatsu, Outa Egashira, Toru Maeda, Hagiwara Yoshihito, Honjo Keiji, Tetsuya Otani, Farhan Shafiq, Owada Tamotsu
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
We report detailed observations for temperature deviation (dT) on stacked dice and temperature for satellite dice (Ts) on several base materials with different thermal resistances to inspire new concepts for innovative collective bonding under a Ther
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7d4e182dd5a56b2306990745879bd8a0
https://doi.org/10.1109/ectc.2017.47
https://doi.org/10.1109/ectc.2017.47
Autor:
Ebisawa Katsuyuki, Hidekazu Yagi, Honjo Keiji, Tatsuo Nagamatsu, Daisuke Motomura, Ishimatsu Tomoyuki, Takayuki Saito, Mori Daichi
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
As three-dimensional Through-Silicon Via (3D-TSV) packaging is emerging in the semiconductor market to integrate multiple functions in a system for further miniaturization, thermal compression bonding (TCB), which stacks multiple bare chips on top of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0183c6ec170889a094c0b72a86906fd6
https://doi.org/10.1109/ectc.2016.224
https://doi.org/10.1109/ectc.2016.224