Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Tatsuhiko Ise"'
Autor:
Junji Senzaki, Hajime Okumura, Tatsuhiko Ise, Tomohisa Kato, Tsuguo Sakurada, Kazutoshi Kojima, Satoshi Hashimoto, Susumu Tsukimoto, Genta Maruyama
Publikováno v:
Journal of Electronic Materials. 47:6722-6730
The high-angular-resolution electron backscatter diffraction (HR-EBSD) technique has been utilized to evaluate the elastic strain distribution of grinding-induced damage layers in silicon carbide wafers. HR-EBSD analysis, along with transmission elec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f69862f523aec2d8938e7c45e5a53ab7
https://doi.org/10.1007/s11664-018-6585-y
https://doi.org/10.1007/s11664-018-6585-y
Autor:
Junji Senzaki, Satoshi Hashimoto, Kazutoshi Kojima, Susumu Tsukimoto, Genta Maruyama, Tomohisa Kato, Hajime Okumura, Tatsuhiko Ise, Tsuguo Sakurada
Publikováno v:
Materials Science Forum. 897:177-180
Evaluation of surface damage layers formed by mechanical grinding processes is indispensable in epi-ready SiC wafer preparation. As well as microstructure, the analysis of local strain distribution in the damage layers gives a clue on control of the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c181f87771e6400f83d0f3f7584dc136
https://doi.org/10.4028/www.scientific.net/msf.897.177
https://doi.org/10.4028/www.scientific.net/msf.897.177
Publikováno v:
Journal of the Surface Finishing Society of Japan. 49:1310-1315
We studied the development of alkaline and electroplating baths of Sn-Ag binary alloy using 5, 5-dimethylhydantoin (DMHy) as a Pb-free solder plating bath under various conditions, such as metal content, complex agent concentration, pH, current densi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2246df8b71eb224c6f5013d165e3455d
https://doi.org/10.4139/sfj.49.1310
https://doi.org/10.4139/sfj.49.1310