Zobrazeno 1 - 10
of 11
pro vyhledávání: '"Tang Gong Yue"'
Publikováno v:
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).
Die attach and interconnect materials for power module device studied in this experiment included pressure-less sintering paste and SnSb solder. The initial evaluation on various pressure-less silver (Ag) sintering die attach pastes showed that type
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9c50cbfb034366a09f4c379378c87b8c
https://doi.org/10.1109/eptc50525.2020.9315011
https://doi.org/10.1109/eptc50525.2020.9315011
Publikováno v:
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).
With the increasing demand of compact and high power rated power module in the EV / HEV (Electric Vehicle / Hybrid Electric Vehicle) industry, packaging of power module is getting more challenging. The push for intelligent power modules in the dynami
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::779da9b01d2371975cbe1d98a74125c7
https://doi.org/10.1109/eptc47984.2019.9026628
https://doi.org/10.1109/eptc47984.2019.9026628
Autor:
John H. Lau, Tang Gong Yue
Publikováno v:
Microelectronics Reliability. 52:2660-2669
Thermal performances of 3D IC integration system-in-package (SiP) with TSV (through silicon via) interposer/chip are investigated based on heat-transfer and CFD (computational fluid dynamic) analyses. Emphases are placed on the determination of (1) t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2ff0ebac71bed2904985b8ee0d46eaef
https://doi.org/10.1016/j.microrel.2012.04.002
https://doi.org/10.1016/j.microrel.2012.04.002
Autor:
Yen Yi Germaine Hoe, Zhang Xiaowu, Chai Tai Chong, John H. Lau, Tang Gong Yue, Pinjala Damaruganath, Kripesh Vaidyanathan
Publikováno v:
2009 11th Electronics Packaging Technology Conference.
In this paper, the effect of TSV (Through Silicon Via) parameters on the equivalent thermal conductivity of TSV interposer and the effect of the TSV interposer on the thermal performance of the package have been elaborated. The modeling approach usin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d00bb974fb870c8d95338a1e0357a3fc
https://doi.org/10.1109/eptc.2009.5416445
https://doi.org/10.1109/eptc.2009.5416445
Autor:
John H. Lau, Tang Gong Yue
Publikováno v:
2009 59th Electronic Components and Technology Conference.
Thermal performances of 3D stacked TSV (through silicon via) chips filled with copper are investigated based on heat-transfer CFD (computational fluid dynamic) analyses. Emphases are placed on the determination of (1) empirical equations for the equi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a56a7b24bbfdec94aa71f31742a8ea24
https://doi.org/10.1109/ectc.2009.5074080
https://doi.org/10.1109/ectc.2009.5074080
Autor:
T.S. Pin, Tang Gong Yue, John H. Lau, Damaruganath Pinjala, N. Khan, Yu Ai Bin, Kripesh Vaidyanathan, T.K. Chuan
Publikováno v:
2008 10th Electronics Packaging Technology Conference.
In this paper, an integrated liquid cooling system for 3D stacked modules with high power dissipation is proposed. The fluidic interconnects in this system are elaborated and the sealing technique for different fluid interfaces is discussed. Meanwhil
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1a1673599416b020026cd7777d1d1b1e
https://doi.org/10.1109/eptc.2008.4763491
https://doi.org/10.1109/eptc.2008.4763491
Autor:
John H. Lau, Tang Gong Yue, S.P. Tan, Pinjala Damaruganath, N. Khan, Kok Chuan Toh, Kripesh Vaidyanathan
Publikováno v:
2008 10th Electronics Packaging Technology Conference.
Thermal management in 3D packaging is a critical factor to be considered in enabling this technology to be exploited further. Heat density in excess of 100 W/cm2 can be achieved due to the smaller footprint of such packages. Liquid cooling through mi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f031a28de1b915debaecf3c14a58a15f
https://doi.org/10.1109/eptc.2008.4763459
https://doi.org/10.1109/eptc.2008.4763459
Akademický článek
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Autor:
Hoe, Y.Y.G., Tang Gong Yue, Damaruganath, P., Chai Tai Chong, Lau, J.H., Zhang Xiaowu, Vaidyanathan, K.
Publikováno v:
11th Electronics Packaging Technology Conference, 2009. EPTC '09; 2009, p778-786, 9p
Autor:
Lau, John H., Lim, Ying Ying, Lim, Teck Guan, Tang, Gong Yue, Khong, Chee Houe, Zhang, Xiaowu, Ramana, Pamidighantam V., Zhang, Jing, Tan, Chee Wei, Chandrappan, Jayakrishnan, Chai, Joey, Li, Jing, Tangdiongga, Geri, Kwong, Dim Lee
Publikováno v:
Proceedings of SPIE; Nov2008, Issue 1, p689907-689907-20, 20p