Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Tanaya Sahu"'
Autor:
Liqiong Wei, Mesut Meterelliyoz, Oleg Golonzka, Pedro A. Quintero, M. Sekhar, Kevin J. Fischer, Ajay Vangapaty, Pulkit Jain, Tanaya Sahu, Blake C. Lin, Chris Connor, P. Hentges, Nathan L. Strutt, Albert Chen, Fatih Hamzaoglu, Umut Arslan, Alzate-Vinasco Juan G
Publikováno v:
ISSCC
A resistive RAM (ReRAM) macro is developed as a low-cost, magnetic-disturb-immune option for embedded, non-volatile memory for SoCs used in IoT and automotive applications. We demonstrate the smallest ReRAM subarray density of 10.1Mb/mm2 in a 22nm lo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3307933ad0e97f1ac4f7229ae0558178
https://doi.org/10.1109/isscc.2019.8662393
https://doi.org/10.1109/isscc.2019.8662393
Autor:
Jim OrDonnell, Fatih Hamzaoglu, Tahir Ghani, Kevin J. Fischer, Justin S. Brockman, Oleg Golonzka, Christopher J. Wiegand, Liqiong Wei, Nilanjan Das, Umut Arslan, Pulkit Jain, Blake C. Lin, Juan G. Alzate, Tanaya Sahu, Pedro A. Quintero, Mesut Meterelliyoz, P. Hentges, M. Sekhar, Ajay Vangapaty, Conor P. Puls, Rawshan Jahan
Publikováno v:
ISSCC
STT-MRAM has been emerging as a very-promising high-density embedded non-volatile memory (eNVM) [1], [2]. Embedded Flash memory has been the leading eNVM technology, but STT-MRAM has been developed as a better solution for continuing scaling, speed a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f15f74d871c0ad943ef0fee492be78b5
https://doi.org/10.1109/isscc.2019.8662444
https://doi.org/10.1109/isscc.2019.8662444
Publikováno v:
ICCAD
Double/Multiple-patterning (DP/MP) lithography in a multiple litho-etch steps process is a favorable solution for technology scaling to the 20nm node and below. Mask-assignment conflicts represent the biggest challenge for MP and limiting them throug
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ed59186e8228a6d9eebd778e9e39cdcb
https://doi.org/10.1145/2429384.2429395
https://doi.org/10.1145/2429384.2429395