Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Tamil, Jonathan"'
Autor:
Riedel, Jörg, Krömer, Florian, Ritter, Hartmut, Bayer, Kevin, Tamil, Jonathan, Lommel, Dietmar, Becker, Stefan
Publikováno v:
Berlin, Germany : Deutsche Gesellschaft für Akustik (2019). doi:10.18154/RWTH-CONV-239229
Proceedings of the 23rd International Congress on Acoustics : integrating 4th EAA Euroregio 2019 : 9-13 September 2019 in Aachen, Germany / proceedings editors: Martin Ochmann, Michael Vorländer, Janina Fels
Proceedings of the 23rd International Congress on Acoustics : integrating 4th EAA Euroregio 2019 : 9-13 September 2019 in Aachen, Germany / proceedings editors: Martin Ochmann, Michael Vorländer, Janina Fels23. International Congress on Acoustics, ICA 2019, Aachen, Germany, 2019-09-09-2019-09-13
Proceedings of the 23rd International Congress on Acoustics : integrating 4th EAA Euroregio 2019 : 9-13 September 2019 in Aachen, Germany / proceedings editors: Martin Ochmann, Michael Vorländer, Janina Fels
Proceedings of the 23rd International Congress on Acoustics : integrating 4th EAA Euroregio 2019 : 9-13 September 2019 in Aachen, Germany / proceedings editors: Martin Ochmann, Michael Vorländer, Janina Fels23. International Congress on Acoustics, ICA 2019, Aachen, Germany, 2019-09-09-2019-09-13
Proceedings of the ICA 2019 and EAA Euroregio : 23rd International Congress on Acoustics, integrating 4th EAA Euroregio 2019 : 9-13 September 2019, Aachen, Germany / proceedings editor: Martin Ochmann, Michael Vorländer, Janina Fels 23rd Internation
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c820e967131e05e36ee41e20e2c0e396
Autor:
Tamil, Jonathan1 Jonathan_Tamil@sg.utacgroup.com, Siew Hoon Ore1, Kian Yeow Gan1, Koh, Drake1, Ti In, Michael Gantalao1, Boon Pek Liew1, Teck Wah Park1, Ng, Geraldine1, Yong Bo Yang1, Teh, Daniel1, Suthiwongsunthorn, Nathapong1, Chungpaiboonpatana, Surasit1
Publikováno v:
Journal of Microelectronic & Electronic Packaging. 2012 1st Quarter, Vol. 9 Issue 1, p19-30. 12p.
Autor:
Gan, Kian Yeow, Thammavet, Panumard, Daniel, Ting Lee Teh, Ore, Siew Hoon, Tamil, Jonathan, Hunat, Christopher, Yang, Yongbo, Suthiwongsunthorn, Nathapong, Laihog, Ekachai, Wattanakaroon, Wanpen, Sirinorakul, Saravuth, Bin, Gu, Ghee, Ang Choon, Hong, Ting Siew
Publikováno v:
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC); 2012, p582-587, 6p
Autor:
Ore, Siew Hoon, Kian Yeow Gan, Tamil, Jonathan, Suthiwongsunthorn, Nathapong, Chungpaiboonpatana, Surasit
Publikováno v:
2011 IEEE 13th Electronics Packaging Technology Conference; 1/ 1/2011, p714-721, 8p
Publikováno v:
Advanced Materials Research; June 2009, Vol. 74 Issue: 1 p319-322, 4p