Zobrazeno 1 - 10
of 11
pro vyhledávání: '"Tamba Tugbawa"'
Autor:
Ushasree Katakamsetty, Stefan Nikolaev Voykov, Boris Vasilev, Sam Nakagawa, Tamba Tugbawa, Jansen Chee, Aaron Gower-Hall, Brian Lee, Weiyang Zhu, Bifeng Li, Kimiko Ichikawa
Publikováno v:
2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a9d730bb1c08d2a22fd6f99ff721d780
https://doi.org/10.1109/edtm55494.2023.10103106
https://doi.org/10.1109/edtm55494.2023.10103106
Publikováno v:
Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519).
We present a characterization and modeling methodology for chip-level simulation of pattern dependencies in the fabrication of copper interconnects. The methodology integrates semi-empirical models for copper CMP and copper plating processes, and use
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::683862a4e0462e82ee3f3799da83eb8a
https://doi.org/10.1109/iitc.2002.1014922
https://doi.org/10.1109/iitc.2002.1014922
Publikováno v:
MRS Proceedings. 767
In this work, we present an integrated prediction of thickness variations in electroplating and chemical mechanical polishing (CMP) processes across an entire chip for random layouts. We achieve chip-scale prediction by first calibrating both electro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::155f8ba9849fa6a7438ad2d7d8bf28f2
https://doi.org/10.1557/proc-767-f7.5
https://doi.org/10.1557/proc-767-f7.5
Publikováno v:
MRS Proceedings. 767
Our group has proposed several chip-scale CMP models, with key assumptions including the notion of planarization length in the pattern density model [1], and step height dependent polishing rate in the density step height model [2]. In the effective
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9c398b23df9d2205001218fa227d4f2c
https://doi.org/10.1557/proc-767-f1.3
https://doi.org/10.1557/proc-767-f1.3
Publikováno v:
MRS Proceedings. 671
Wepropose an integratedcontact mechanics and density-step-heightmodel of pattern dependencies for the chemical-mechanical polishing (CMP) of multi-level copper interconnects, and show preliminary comparisons with experimental data for the overburden
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e12b9c2b0bcc3b28b85de599765b4cb1
https://doi.org/10.1557/proc-671-m4.3
https://doi.org/10.1557/proc-671-m4.3
Autor:
Tae Park, Gerald Martin, Albert Gonzales, Paul Lefevre, John Nguyen, Tom Brown, Duane S. Boning, Tamba Tugbawa, Michael Gostein
Publikováno v:
MRS Proceedings. 671
Wehaveusedalargepatterntestmaskandaspecificarrangementofstructuresonawaferfor direct measurement of an average planarization length for copper chemical mechanical polishing (CMP)processes.Weproposenewminimum,maximum,andaverageplanarizationlengthdefin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::daa53fe123e7f0b97fa7a4c62cebcd51
https://doi.org/10.1557/proc-671-m4.4
https://doi.org/10.1557/proc-671-m4.4
Publikováno v:
Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461).
Copper electroplated profiles exhibit pattern dependent topography. We propose a methodology for the characterization and modeling of feature scale copper step heights and the height of copper array regions, as a function of layout parameters. The re
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9b4724340f4b2c45753f10ea00c004e5
https://doi.org/10.1109/iitc.2001.930082
https://doi.org/10.1109/iitc.2001.930082
Autor:
S. Hymes, Tom Brown, M. Joffe, Tamba Tugbawa, W. Sands, Duane S. Boning, H. Yeung, Tae Park, M. Banet, John Nguyen, K. Smekalin, T. West
Publikováno v:
MRS Proceedings. 566
A planarization monitor has been applied to the copper system to investigate pattern dependencies during copper overburden planarization. Conventional profilometry and a noncontact, acousto-optic measurement tool, the Insite 300, are utilized to quan
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e923dba7b2ebfd9c14b77607732e9872
https://doi.org/10.1557/proc-566-211
https://doi.org/10.1557/proc-566-211
Autor:
Dennis Ouma, Tae Park, Charles Oji, Brian Lee, Tamba Tugbawa, Taber H. Smith, Duane S. Boning
Publikováno v:
MRS Proceedings. 566
In previous work, we have formalized the notions of “planarization length” and “planarization response function” as key parameters that characterize a given CMP consumable set and process. Once extracted through experiments using carefully de
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9f3162edeffaa2f98e0d88d083715146
https://doi.org/10.1557/proc-566-197
https://doi.org/10.1557/proc-566-197
Autor:
Chidi Chidambaram, Tae Park, Gregg Shin, Christopher L. Borst, Tamba Tugbawa, Duane S. Boning
Publikováno v:
Journal of The Electrochemical Society. 151:C418
In this paper, a methodology for the characterization and modeling of pattern-dependent problems in copper interconnect topography is presented. For the electroplating process, the methodology consists of test structure and mask design to examine fea
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::838b49bc0038fb2a68bc5c50b19bcbb1
https://doi.org/10.1149/1.1723496
https://doi.org/10.1149/1.1723496