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Autor:
Yoshimura, Tetsuzo1 tetsu@cc.teu.ac.jp, Tamaki, Daigo1, Kawamura, Shota1, Arai, Yukihiko1, Asama, Kunihiko1
Publikováno v:
IEEE Transactions on Components & Packaging Technologies. Sep2004, Vol. 27 Issue 3, p468-471. 4p.