Výsledky vyhledávání - "Talita A. Vida"

Akademický článek

Fibrous PCL/PLLA Scaffolds Obtained by Rotary Jet Spinning and Electrospinning

Autor: Talita Almeida Vida, Adriana Cristina Motta, Arnaldo Rodrigues Santos Jr., Guinea Brasil Camargo Cardoso, Crystopher Cardoso de Brito, Cecília Amélia de Carvalho Zavaglia

Publikováno v: Materials Research, Vol 20, Iss suppl 2, Pp 910-916 (2018)

Rotary jet spinning (RJS) and electrospinning are techniques to obtain fibrous scaffolds. RJS is a simple method, which fabricates three-dimensional fibers by exploiting a high-speed rotating nozzle, creating a polymer jet which stretches until solid

Externí odkaz: https://doaj.org/article/1e7104ef24a148a2be834ad838d8d470

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Tailoring microstructure and microhardness of Zn−1wt.%Mg−(0.5wt.%Mn, 0.5wt.%Ca) alloys by solidification cooling rate

Autor: Crystopher Brito, Noé Cheung, Cássio A.P. Silva, Thiago Soares Lima, Amauri Garcia, Talita A. Vida

Publikováno v: Scopus
Repositório Institucional da UNESP
Universidade Estadual Paulista (UNESP)
instacron:UNESP

Made available in DSpace on 2021-06-25T10:29:48Z (GMT). No. of bitstreams: 0 Previous issue date: 2021-04-01 Biodegradable Zn-based alloys, particularly Zn−Mg alloys with the addition of alloying elements, have been intensively investigated aiming

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f762a262ad42f762cfd0ac028d75a72a
https://doi.org/10.1016/s1003-6326(21)65559-0

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Preparação e caracterização de nanofibras da blenda PLLA/PCL obtidas pelos processos de eletrofiação e rotofiação

Autor: Brito, Talita Almeida Vida de, 1985

Publikováno v: Biblioteca Digital de Teses e Dissertações da Universidade Estadual de Campinas (UNICAMP)
Universidade Estadual de Campinas (UNICAMP)
instacron:UNICAMP

Orientador: Cecília Amélia de Carvalho Zavaglia Dissertação (mestrado) - Universidade Estadual de Campinas, Faculdade de Engenharia Mecânica Resumo: Este trabalho apresenta a preparação e caracterização de nanofibras da blenda poli (L-ácido

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::457f31b6bd63f8700d7398459aa8e3ea
https://doi.org/10.47749/t/unicamp.2013.912419

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Near-eutectic Zn-Mg alloys: Interrelations of solidification thermal parameters, microstructure length scale and tensile/corrosion properties

Autor: Crystopher Brito, Talita A. Vida, José E. Spinelli, Noé Cheung, Thiago Soares Lima, Amauri Garcia

Publikováno v: Scopus
Repositório Institucional da UNESP
Universidade Estadual Paulista (UNESP)
instacron:UNESP

Made available in DSpace on 2019-10-06T15:35:42Z (GMT). No. of bitstreams: 0 Previous issue date: 2019-05-01 Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP) Conselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq) Zn-M

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::811561b19370dc53bb387a86c1d22868
https://doi.org/10.1016/j.cap.2019.02.013

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Solidificação unidirecional de ligas Zn-Mg

Autor: Brito, Talita Almeida Vida de, 1985

Publikováno v: Biblioteca Digital de Teses e Dissertações da Universidade Estadual de Campinas (UNICAMP)
Universidade Estadual de Campinas (UNICAMP)
instacron:UNICAMP

Orientador: Amauri Garcia Tese (doutorado) - Universidade Estadual de Campinas, Faculdade de Engenharia Mecânica Resumo: A adição de Mg para melhorar a estabilidade à corrosão de recobrimentos de Zn, é uma prática comum na produção de compon

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::183904476cd33a807a4c5facc00ae7fb
https://doi.org/10.47749/t/unicamp.2017.989810

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Microstructure features and mechanical/electrochemical behavior of directionally solidified Al−6wt.%Cu−5wt.%Ni alloy

Autor: Adilson V. Rodrigues, Crystopher Brito, Thiago Soares Lima, Amauri Garcia, Talita A. Vida, Noé Cheung

Publikováno v: Scopus
Repositório Institucional da UNESP
Universidade Estadual Paulista (UNESP)
instacron:UNESP

Made available in DSpace on 2022-04-28T19:40:59Z (GMT). No. of bitstreams: 0 Previous issue date: 2021-06-01 The effects of the addition of 5.0 wt.% Ni to an Al−6wt.%Cu alloy on the solidification cooling rate T˙ growth rate (VL), length scale of

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a4142473b4ff94edf91e9801714682af

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Microstructure and Tensile/Corrosion Properties Relationships of Directionally Solidified Al–Cu–Ni Alloys

Autor: Talita A. Vida, Adilson V. Rodrigues, Thiago Soares Lima, Amauri Garcia, Noé Cheung, Crystopher Brito

Publikováno v: Metals and Materials International. 24:1058-1076

Al–Cu–Ni alloys are of scientific and technological interest due to high strength/high temperature applications, based on the reinforcement originated from the interaction between the Al-rich phase and intermetallic composites. The nature, morpho

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::6ce704ffa12ab3fa7ee8a76780f5c312
https://doi.org/10.1007/s12540-018-0116-5

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Fibrous PCL/PLLA Scaffolds Obtained by Rotary Jet Spinning and Electrospinning

Autor: Crystopher Brito, Arnaldo R. Santos, Guinea Brasil Camargo Cardoso, Cecília Amélia de Carvalho Zavaglia, Talita A. Vida, Adriana Cristina Motta

Publikováno v: Materials Research, Vol 20, Iss suppl 2, Pp 910-916 (2018)
Materials Research, Issue: ahead, Published: 15 MAR 2018
Materials Research v.20 suppl.2 2017
Materials research (São Carlos. Online)
Universidade Federal de São Carlos (UFSCAR)
instacron:ABM ABC ABPOL

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::07c4d4b9d9fb28caa02a5797cdbfc4f2
http://www.scielo.br/pdf/mr/v20s2/1516-1439-mr-1980-5373-MR-2016-0969.pdf

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Interrelationship of thermal parameters, microstructure and microhardness of directionally solidified Bi–Zn solder alloys

Autor: Noé Cheung, Thiago A. Costa, Rudimylla S. Septimio, Talita A. Vida, Amauri Garcia

Publikováno v: Microelectronics Reliability. 78:100-110

Due to the health and environmental concerns associated with lead usage, the research on alternative lead-free alloys for replacing lead-based solders is a global demand. Despite numerous studies on Sn-based lead-free solders in recent years, there i

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::ae792532902cc196e54a06f5d3eaa33b
https://doi.org/10.1016/j.microrel.2017.08.007

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