Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Takeshi Kawana"'
Autor:
Takeshi Kawana, Hirohide Abe
Publikováno v:
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series C. 67:3311-3316
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fa4023af9588495493f90e5e2821a9b7
https://doi.org/10.1299/kikaic.67.3311
https://doi.org/10.1299/kikaic.67.3311
Publikováno v:
Polymer Engineering & Science. 36:819-826
Micro flow marks have been found to occur in injection molding of polycarbonate. Their minimum depth is ˜ 5 nm on the mold smooth surface. Such marks seem to be formed when the molten polymer near the mold wall at the advancing front is cooled to th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c498998ea749357ad7350f2e359b6f80
https://doi.org/10.1002/pen.10469
https://doi.org/10.1002/pen.10469
Autor:
Suzuki Takamichi, Yasuo Shibazaki, Yoichiro Tamoto, Yuhji Enomoto, Takashi Ohta, Takeshi Kawana
Publikováno v:
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series C. 61:2147-2152
In the assembly of shafts and plates, calk conditions were investigated to realize high precision in the right angles between shafts and plates as well as precisely parallel shafts. With regard to the calk load, higher precision was attainable when t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1d700cdc866e942bcfdfb1abd099963d
https://doi.org/10.1299/kikaic.61.2147
https://doi.org/10.1299/kikaic.61.2147
Publikováno v:
IEEJ Transactions on Industry Applications. 115:775-783
This paper presents a new discrimination procedure of signal waveforms, based on wavelet theory, for the inspection of rotating machinery. The Wavelet Transform decomposes signals into time-frequency space, not into mere frequency space, limited by t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cc22ad247035aedb34eeee276d41b463
https://doi.org/10.1541/ieejias.115.775
https://doi.org/10.1541/ieejias.115.775
Autor:
Takeshi Kawana, Tamio Arai
Publikováno v:
CIRP Annals. 43:31-34
Summary High density assembly of PCB(Printed Circuit Board) is essential to small-size electronic devices. This paper reports on the interconnection of insulated fine wires of 20-100 micrometer diameters. Three new techniques are discussed: first, th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a72875123f0991d1911484776bed41df
https://doi.org/10.1016/s0007-8506(07)62157-x
https://doi.org/10.1016/s0007-8506(07)62157-x
Publikováno v:
Journal of the Japan Society for Precision Engineering. 60:1019-1023
This paper describes the conditions, especially for bonding time and temperature. Assuming that bonding of Cu depends on its recrystallization, the process can be estimated as follows. First, the temperature change of bonding parts is calculated by a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d4369e44371b37cd525d999a60a81a0c
https://doi.org/10.2493/jjspe.60.1019
https://doi.org/10.2493/jjspe.60.1019
Publikováno v:
Journal of Robotics and Mechatronics. 5:476-480
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fc064375f2ac82cde30dacb36f6c7042
https://doi.org/10.20965/jrm.1993.p0476
https://doi.org/10.20965/jrm.1993.p0476
Autor:
Takeshi Kawana
Publikováno v:
Journal of the Japan Society for Precision Engineering. 57:236-239
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5b544eacf1890bce7ede43047ee55728
https://doi.org/10.2493/jjspe.57.236
https://doi.org/10.2493/jjspe.57.236
Autor:
Takeshi Kawana
The purpose of this chapter is to examine international jurisdiction and choice of law for e-commerce involving economic legal issues. International jurisdiction and choice of law will be determined under private legal principles, but as e-commerce i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eb5ceec7605533f1a5cc034d33908775
https://doi.org/10.4018/978-1-59904-828-4.ch015
https://doi.org/10.4018/978-1-59904-828-4.ch015
Publikováno v:
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series C. 56:3103-3108
The automated bonding technique for very fine insulated wires was required to keep pace with multipin semiconductors or high-density circuit boards. We obtained the relationship between the temperature and the time for thermal decomposition of the in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b2574c4a80b83f7959b143a5d9701875
https://doi.org/10.1299/kikaic.56.3103
https://doi.org/10.1299/kikaic.56.3103