Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Takeoka, Yasushi"'
Joint reliability study of solder capped metal pillar bump interconnections on an organic substrate.
Publikováno v:
2012 2nd IEEE CPMT Symposium Japan; 2012, p1-4, 4p
Autor:
Sasaki, Yoshio, Hwang, Myung-Woo, Shirasawa, Kuniyuki, Takeda, Shinichi, Ayukawa, Hiroyuki, Inenaga-Kituara, Katsura, Takeoka, Rei, Kituara, Yasushi, Kawai, Chuichi
Publikováno v:
Heart & Vessels; Jul2008, Vol. 23 Issue 4, p264-270, 7p, 1 Color Photograph, 1 Black and White Photograph, 5 Charts